Replies to post #219785 on Lightwave Logic Inc (LWLG)

[Scope08]

Uh-oh...Rocking Jack alert! eom

[Scope08]

Are you familiar with a gentleman by the name of Tedpeele?

[prototype_101]

Mad Shortman, here's what investors do know

1) LWLG's technology footprint being so small that it can fit 120 of the 200gb (PAM4) modulators into a PLUGGABLE transceiver, and per Andy B of Arista the effect on overall system performance would be a power reduction expected of 20% or greater, this means that LWLG can extend the use of PLUGGABLES for several more years at least through 3.2T and 6.4T before the need for CPO, and of course with PLUGGABLES there is NO NEED for the higher reflow temperatures

2) ECOC 2024 - based on ECOC slides 16 and 17 we know LWLG Tg a year ago was on average at about 187 and rising at a pace of about 15-20 per year so likely it is over 200 now

https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/0d5d1e3e-2052-00d8-bb2f-2b7a2adf0310?origin=1

3) CPO requires 225-255 MAX reflow temperature (for seconds only), see Broadcom's document page 6 chart here

https://docs.broadcom.com/doc/PACKAGING-AN101-RDS.pdf

I believe LWLG has made a major push in this area of Development in the last year because of the AI revolution changing the Business Strategy of LWLG, and since ECOC and may well already be in the 225-255 range, but again, LWLG can EASILY extend PLUGGABLES fro several more years at least (where these high temps are not an issue)

[x993231]

If you are long, welcome, but honestly I think that you are just a short that created another ID, that is what is commonly referred to as a wolf in sheep's clothing who's actual motive is to plant doubt by acting stupid and using AI to fill in the rest.

The shorts are more of an organized business than longs. Proly had a meeting and told pumkin to create another new ID (think he has had 4 or 5) they do their best to "costus" money. All of the things that the shorts said couldn't be done they've accomplished.

Off the top of my head

Thermal Stability

Photo Stability

R33 high enough for 5mm device

Compatibility with Silicon and InP

Operating without gold box protection

ALD

100 year performance at 85c

Compatibility with silicon foundry processes

I guess if someone needs something to worry about,,,
Im not sure at this moment if the lab can utilize the new equipment to automate the production of perkinamine or if they established a foothold is Asia yet, so I guess if someone wants to worry about they could.

The shorts said that all of those things were said could not be done so they need a new ID because the others have all been discredited.

X. Oh and they have patents in place where needed and IP the rest.

[KCCO7913]

These are good questions that are currently unanswered.

Until there is a modulator PIC that is assembled into an optical engine (which contains other components)...we won't know.

Some companies publish their full qualification data publicly, and some keep it confidential.

In general, it is up to the foundry to make sure their manufacturing processes adhere to the various standards where applicable, but it is up to the component supplier to ensure the device passes the various reliability qualifications.

Right now, it appears LWLG is publishing material data and once LWLG/a partner finish a PIC (or optical engine)...then further qualification data would exist on a device. Would us shareholders see it? Probably not a full detailed spec sheet, but we would see an announcement on full Telcordia qualification (much like the OpenLight OFC announcement).

[jimjet218]

Yup, new poster and user name created as of July 19 at 1:45 a. m. For someone that doesn't know how the "tech works", has some pretty complex questions. A QUICK further search using your chatgpt would have answered your questions.

I only searched out one of your questions which Jeunke already informed you of.

"No, JEDEC-level stress test results are not usually public knowledge.

Here's why:

1. Proprietary Information:
Companies treat detailed test results as proprietary because they reveal specific weaknesses, margins, or design choices in their products. Sharing those openly could help competitors.


2. Customer-Specific Disclosures:
Results are typically shared privately with key customers (like big OEMs or defense contractors) under NDAs to prove the part meets necessary standards.


3. Certification Statements, Not Data:
Publicly, companies usually just state that a part is "JEDEC qualified" or "meets JEDEC standards." They don’t release the raw data, detailed failure rates, or test specifics.


4. Competitive Advantage:
Publishing data on how robust or fragile your parts are could negatively affect market perception if competitors keep theirs private."

I'm leaning towards you indeed are someone trying to cast doubt where there is no need.

Hoping to hear much more from you in the future to clarify your true colors.

Back to my silent mode....

Jorge

[KCCO7913]

I forgot to address your CMOS/CPO comment.

LWLG's EOP doesn't need to survive a full CMOS manufacturing line. The EOP is added in a BEOL process. Some in the industry even refer to it as a FBEOL (far back end of line).

Some color of what happens in the BEOL is from LWLG's recent PDK announcement - "Lightwave Logic's groundbreaking BEOL process encompasses key steps including EO polymer application, patterning and etching, Atomic Layer Deposition (ALD) encapsulation, EO polymer poling, contact pad opening, chip dicing, and end face creation and polishing. Crucially, the BEOL process is designed for compatibility with existing semiconductor fabrication lines, facilitating seamless integration with silicon photonic device manufacturing flows. This process offers flexibility, applicable at both wafer and chip levels up to the dicing stage."

Further - "This PDK has already been implemented as part of collaborative efforts with two semiconductor foundries."

Now, once the modulator/PIC is complete it needs to be assembled into an optical engine and then that optical engine needs to assembled into a transceiver module. These assembly processes encounter a harsh step called reflow. There, temperatures can briefly hit 250+ degrees C. LWLG's material needs to be able to withstand that. We've heard public statements from LWLG that they have figured out a way to do this packaging successfully (or that their partners have ways to do it without jeopardizing the material). It was a comment from Atikem at an industry event last year where he mentioned it.

CPO thermal constraints are certainly higher than that of pluggable modules. LWLG will likely need to demonstrate long term stability/reliability at temperatures over 85 degrees C. There's no rulebook for CPO, yet. I've seen some companies target 125 degrees C for testing.

My guess is that since LWLG's material has a Tg nearing 200 degrees C, a Td over 250 degrees C, and a new ALD method that protects the material so well that changes are almost immeasurable....it's going to be OK for all these various applications.

[Maddox Kushman]

Bro im literally up over 70% on this and considering taking partial profits or just holding it all. Not everyone is a moonboy. I like LWLG but its important to be unbiased in investing. That's how I lost money just aping inti shit without researching or being critical. At least im in profit while 99% of the people here is at a fat loss. I'm glad I didn't hear about lwlg when yall did because I would have be in the same position but clearly im doing something right. I'm not a big fan of wishful thinking.