Saturday, July 19, 2025 1:43:06 PM
I forgot to address your CMOS/CPO comment.
LWLG's EOP doesn't need to survive a full CMOS manufacturing line. The EOP is added in a BEOL process. Some in the industry even refer to it as a FBEOL (far back end of line).
Some color of what happens in the BEOL is from LWLG's recent PDK announcement - "Lightwave Logic's groundbreaking BEOL process encompasses key steps including EO polymer application, patterning and etching, Atomic Layer Deposition (ALD) encapsulation, EO polymer poling, contact pad opening, chip dicing, and end face creation and polishing. Crucially, the BEOL process is designed for compatibility with existing semiconductor fabrication lines, facilitating seamless integration with silicon photonic device manufacturing flows. This process offers flexibility, applicable at both wafer and chip levels up to the dicing stage."
Further - "This PDK has already been implemented as part of collaborative efforts with two semiconductor foundries."
Now, once the modulator/PIC is complete it needs to be assembled into an optical engine and then that optical engine needs to assembled into a transceiver module. These assembly processes encounter a harsh step called reflow. There, temperatures can briefly hit 250+ degrees C. LWLG's material needs to be able to withstand that. We've heard public statements from LWLG that they have figured out a way to do this packaging successfully (or that their partners have ways to do it without jeopardizing the material). It was a comment from Atikem at an industry event last year where he mentioned it.
CPO thermal constraints are certainly higher than that of pluggable modules. LWLG will likely need to demonstrate long term stability/reliability at temperatures over 85 degrees C. There's no rulebook for CPO, yet. I've seen some companies target 125 degrees C for testing.
My guess is that since LWLG's material has a Tg nearing 200 degrees C, a Td over 250 degrees C, and a new ALD method that protects the material so well that changes are almost immeasurable....it's going to be OK for all these various applications.
LWLG's EOP doesn't need to survive a full CMOS manufacturing line. The EOP is added in a BEOL process. Some in the industry even refer to it as a FBEOL (far back end of line).
Some color of what happens in the BEOL is from LWLG's recent PDK announcement - "Lightwave Logic's groundbreaking BEOL process encompasses key steps including EO polymer application, patterning and etching, Atomic Layer Deposition (ALD) encapsulation, EO polymer poling, contact pad opening, chip dicing, and end face creation and polishing. Crucially, the BEOL process is designed for compatibility with existing semiconductor fabrication lines, facilitating seamless integration with silicon photonic device manufacturing flows. This process offers flexibility, applicable at both wafer and chip levels up to the dicing stage."
Further - "This PDK has already been implemented as part of collaborative efforts with two semiconductor foundries."
Now, once the modulator/PIC is complete it needs to be assembled into an optical engine and then that optical engine needs to assembled into a transceiver module. These assembly processes encounter a harsh step called reflow. There, temperatures can briefly hit 250+ degrees C. LWLG's material needs to be able to withstand that. We've heard public statements from LWLG that they have figured out a way to do this packaging successfully (or that their partners have ways to do it without jeopardizing the material). It was a comment from Atikem at an industry event last year where he mentioned it.
CPO thermal constraints are certainly higher than that of pluggable modules. LWLG will likely need to demonstrate long term stability/reliability at temperatures over 85 degrees C. There's no rulebook for CPO, yet. I've seen some companies target 125 degrees C for testing.
My guess is that since LWLG's material has a Tg nearing 200 degrees C, a Td over 250 degrees C, and a new ALD method that protects the material so well that changes are almost immeasurable....it's going to be OK for all these various applications.
Recent LWLG News
- Form 10-Q - Quarterly report [Sections 13 or 15(d)] • Edgar (US Regulatory) • 05/15/2026 08:15:54 PM
- Lightwave Logic Shares Slip Despite Revenue Growth and Expanded Market Opportunity (LWLG) • IH Market News • 05/14/2026 12:39:41 PM
- Form S-3ASR - Automatic shelf registration statement of securities of well-known seasoned issuers • Edgar (US Regulatory) • 05/08/2026 09:10:21 PM
- Lightwave Logic Announces Availability of Version 1.1 of Its Polymer Photonics PDK, Advancing Process Integration and Foundry Transfer • ACCESS Newswire • 05/07/2026 01:30:00 PM
- Lightwave Logic, Inc. Announces Timing of First Quarter 2026 Financial Results and Business Update Call • ACCESS Newswire • 05/05/2026 12:30:00 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/30/2026 01:28:01 AM
- Lightwave Logic (LWLG) intellectual property advisory engagement supports licensing model expansion • IH Market News • 04/29/2026 02:28:14 PM
- Lightwave Logic Engages Michael Best as Strategic Intellectual Property Advisor • ACCESS Newswire • 04/29/2026 12:30:00 PM
- Form 8-K - Current report • Edgar (US Regulatory) • 04/21/2026 12:02:14 PM
- Form 424B5 - Prospectus [Rule 424(b)(5)] • Edgar (US Regulatory) • 04/21/2026 12:00:10 PM
- Lightwave Logic Announces Scheduling of Annual Shareholder Meeting • ACCESS Newswire • 04/14/2026 12:30:00 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/10/2026 10:37:55 PM
- Form 144 - Report of proposed sale of securities • Edgar (US Regulatory) • 04/10/2026 09:22:42 PM
- Form ARS - Annual Report to Security Holders • Edgar (US Regulatory) • 04/10/2026 08:38:42 PM
- Form DEF 14A - Other definitive proxy statements • Edgar (US Regulatory) • 04/10/2026 08:31:19 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/08/2026 11:50:53 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/07/2026 08:07:26 PM
- Form 144 - Report of proposed sale of securities • Edgar (US Regulatory) • 04/07/2026 07:42:29 PM
- Form 144 - Report of proposed sale of securities • Edgar (US Regulatory) • 04/06/2026 08:06:59 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/03/2026 01:47:09 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/02/2026 08:39:13 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 04/02/2026 08:14:40 PM
- Form 144 - Report of proposed sale of securities • Edgar (US Regulatory) • 04/01/2026 07:52:04 PM
- Form 144 - Report of proposed sale of securities • Edgar (US Regulatory) • 04/01/2026 07:02:07 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 03/31/2026 08:01:17 PM
