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Re: Maddox Kushman post# 219785

Saturday, 07/19/2025 1:43:06 PM

Saturday, July 19, 2025 1:43:06 PM

Post# of 231851
I forgot to address your CMOS/CPO comment.

LWLG's EOP doesn't need to survive a full CMOS manufacturing line. The EOP is added in a BEOL process. Some in the industry even refer to it as a FBEOL (far back end of line).

Some color of what happens in the BEOL is from LWLG's recent PDK announcement - "Lightwave Logic's groundbreaking BEOL process encompasses key steps including EO polymer application, patterning and etching, Atomic Layer Deposition (ALD) encapsulation, EO polymer poling, contact pad opening, chip dicing, and end face creation and polishing. Crucially, the BEOL process is designed for compatibility with existing semiconductor fabrication lines, facilitating seamless integration with silicon photonic device manufacturing flows. This process offers flexibility, applicable at both wafer and chip levels up to the dicing stage."

Further - "This PDK has already been implemented as part of collaborative efforts with two semiconductor foundries."

Now, once the modulator/PIC is complete it needs to be assembled into an optical engine and then that optical engine needs to assembled into a transceiver module. These assembly processes encounter a harsh step called reflow. There, temperatures can briefly hit 250+ degrees C. LWLG's material needs to be able to withstand that. We've heard public statements from LWLG that they have figured out a way to do this packaging successfully (or that their partners have ways to do it without jeopardizing the material). It was a comment from Atikem at an industry event last year where he mentioned it.

CPO thermal constraints are certainly higher than that of pluggable modules. LWLG will likely need to demonstrate long term stability/reliability at temperatures over 85 degrees C. There's no rulebook for CPO, yet. I've seen some companies target 125 degrees C for testing.

My guess is that since LWLG's material has a Tg nearing 200 degrees C, a Td over 250 degrees C, and a new ALD method that protects the material so well that changes are almost immeasurable....it's going to be OK for all these various applications.
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