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See Alienate #3 below for the truth on the one time bonuses several years ago that criminal paid Shorts keeping distorting
Ted – fair questions, so here’s where I’m coming from—
\1) I’m not “new” to the board\
– Been lurking since early 2021 when news sources were basically Yahoo! Finance + this board.
– I mostly read (jeunke, waterstacks, etc.) because flame wars drowned out anything I could add and I was still learning.
– Popped back in after the CEO swap and—lucky me—today I’m stuck in a 5-hour training call, so I finally had time to post real research.
\2) Why I referenced the 2 k-hour data\
– Foundries that run commercial silicon photonics lines typically won’t touch new electro-optic materials without Telcordia-style GR-468 life-test proof (1 k–2 k hrs at 85 °C).
– LWLG announced hitting that mark in mid-2021; the uplist and the reliability press release are both dated that summer.
– Whether you think the bonus was excessive, the data was a prerequisite for any serious foundry engagement—that’s why I mentioned it.
\3) About the \$2.6 M bonuses\
– I’m not “defending” them as ideal—seven-figure cash at a pre-revenue company isn’t my favorite look.
– They were disclosed in advance as an “extraordinary achievement award” for (a) Nasdaq uplist and (b) first high-temp reliability milestone.
– Shareholders still gave 90 %+ “say-on-pay” approval the following year, so the comp committee had cover.
\4) Raised expectations vs. reality\
– Agree Lebby’s 2021 ASM talk made commercialization sound like a one-year sprint. We’re three years later and still waiting; I share the frustration.
– But since then they’ve:
• Demos at ECOC/OFC (200 Gb PAM-4)
• Released a BEOL PDK
• Qualified two foundry shuttles
• Started Polariton sampling
– If 2025 ends without a Tier-1 contract, I’ll be first in line to criticize the board for optimism > delivery.
\5) Why use ChatGPT?\
– I pay for the Pro tier; the model will cough up SEC filings with line numbers and citation links in seconds.
– Saves me digging through EDGAR at snail speed.
– Figured others might find it useful, especially with the board so noisy lately.
\6) Motive check\
– No trading agenda here: I hold a mid-five-figure position, no options, no shorting, no paid promo.
– Just killing time in a long work call and trying to surface facts that can be verified.
\Bottom line\
Yes, the 2021 cash awards look rich. They were one-offs tied to public milestones, not a pattern of constant payouts. Going forward, it’s all about whether the new CEO lands the first commercial deal—and whether the board reins in comp if he doesn’t.
(As always, do your own DD; just sharing what I found.) to
Those massive cash bonuses were THE ONLY red flag necessary to know that something wasn’t right with this company when I arrived a few months after they got them and the directors had sold out.
As much as I wanted to believe in what they were painting, once I saw there was still no deal and 5.2 million going to cash bonuses and not even into shares for the top two dogs that was it for me.
They had to show me. This dreamer refused to be a sucker. Been there, done that.
Maybe the science will pull through eventually , but they’ve gotta prove themselves worthy with VALIDATION from the industry that they are something more than a science project
THE PUMP SHALL COMMMMMMEEETHHHHHHHHH
ECOC Slide 20 is the ONLY information you need to understand to know LWLG is a incredible buying opportunity!!
https://api.mziq.com/mzfilemanager/v2/d/307dbc8b-e212-48ba-9968-8cef3f6b5188/0d5d1e3e-2052-00d8-bb2f-2b7a2adf0310?origin=1
On the LEFT is a comparison of LWLG's technology to the touted #1 competitive threat TFLN
On the RIGHT is a comparison to other commercial Polymer materials development companies
To make it EASY PEASY for you, BOTH of these supposed BEST competitors pale by comparison to LWLG!!!!!
LWLG >>>> Fabrication and processing: EASY (foundry compatible) & LOW TEMP (<150°C)
Couple this with this recent Paper with authors from Cisco, Intel, and Arista (Andy B) which points out just how crappy TFLN's position is today in being ready to commercialize!! TFLN is a joke really!!! Even the #1 TFLN Development company recently said it may take 3 or more years from now to be able to scale volume of TFLN modulators!!! here from the Paper
“For monolithic TFLN modulators and PICs, 150 mm wafer is the largest size for product presently. Limited wafer size, large device footprint, relatively high material cost, and thin-film uniformity contribute a large portion of the chip cost. Although the chip fabrication is not overly complex, uniform waveguide formation for ultra-low loss operation is not trivial, which necessitates optimized photolithography, etching technology, and post-fabrication processes. Additionally, long-term DC drift remains a challenge for TFLN. To make these modulators commercially viable and reliable, thermally or electrically phase control is a must.
TFLN modulators heterogeneously integrated with silicon or Si3N4 are still in the R&D stage. Similar to III-V-on-silicon heterogeneous integration, TFLN integration occurs towards the back-end-of-line (BEOL) process and requires specialized processing tools along with stringent cross-contamination controls, especially if large-wafer scale processing is involved. The TFLN transfer step is critical for achieving high yield and optimal device performance.”
https://ieeexplore.ieee.org/abstract/document/10666944/references#references
Global Foundries Anthony Yu talking about "new materials" contains the hard truth that Polymers will be the only real choice, start watching the clip around 10 minute market, the first words out of Yu's mouth when he talks of new materials is Optical Polymers!! then Yu goes on to say TFLN with the snarkiest possible look on his face!!! why? because TFLN can't scale in volume, and it has Foundry contamination issues, and it can only be sourced primarily from China, and even worse when he talks about BTO he actually jokes about having to hide that from the management, and that's because of high contamination risks to the Foundry!!!
Some of the primary challenges in TFLN modulators include the following:
Fabrication Complexity: The highly complex bonding steps lead to non-uniform electro-optical performance and higher optical losses, which reduces production yields and makes the process more difficult to scale up.
Optical Loss: Even though lithium niobate is a low-loss material, it can cause optical losses and manufacturing flaws that lower the efficiency and performance of modulators used for long-distance communication and applications that need to save power.
Thermal Management: The refractive index of lithium niobate changes with temperature, which can affect the operation of TFLN modulators, especially in photonic circuits that are tightly mounted and cannot dissipate heat well. This results in phase drift and reduced efficiency.
Driving voltage and power consumption: LN modulators need high driving voltages to provide a large modulation depth. This makes it difficult to lower the voltage without affecting performance or power and presents a challenge for applications that require power conservation.
High-Frequency Operation: Due to the limitations of the electrode design and modulator signal transmission, high-frequency operation (e.g., above 100 GHz) with low loss and efficient modulation becomes difficult.
Manufacturing complexity, optical losses, poor compatibility with CMOS integration, thermal management issues, and cost constraints hinder the application of TFLN modulators. Solving these problems is crucial to realizing its potential and enabling its widespread application in high-speed optical communication networks.
https://www.mdpi.com/2304-6732/12/5/429
To occasionally offer some counterbalance to these marketing-driven posts, here’s a more objective perspective:
TFLN is no longer a lab experiment — it’s already being used commercially in products from companies like Acacia (Cisco). In contrast, LWLG’s polymers, while promising, have yet to be deployed in a single mass-produced product. There’s a big difference between performance on paper and real-world deployment.
LWLG’s theoretical performance is impressive, especially in terms of r33 values. But long-term reliability, thermal stability, and integration are just as crucial — and that’s where TFLN excels: it has very low optical losses, strong thermal tolerance, and proven reliability over time. Polymer materials, by nature, remain more sensitive to temperature, humidity, and UV, increasing the risk that their performance degrades over time.
So no — TFLN is not going away anytime soon. That said, the market is big enough. Still, the fact that it's taking so long to move from lab to foundry is at the very least a sign that things are more complex than originally presented — and that LWLG might not make it after all.
In summary:
– Yes, LWLG’s theoretical results are impressive (better than TFLN)
– Yes, TFLN clearly has stronger fundamentals and better survival odds as of today.
So you see, Proto — it’s perfectly possible to share accurate and realistic information in a nuanced way ;)
True, we were not told by the Xpert for more than 11 years about the urgent need to solve Moore's Law. We were not told that the whole internet was ready to shut down without the Rescue of the GOO.
We were not told that any day for at least 12 years by the most prolific copy and paster in the world that any day we were going to get a signed financial DEALLLLLLLLLLLLLLLLLLLLL!!!!!!!!!!!!!!!!!!!!!!!.
They just told us all to sit tight for the next decade, because there was no immediate need for our Perk, and that the GOO was really not Through.
Then why the complaining?
Look at the attached post by "love" personally myself "X" that is , I've made enough that I'm not complaining. That my friends we call it a red herring. I could have made 10's of millions, oh well my decision, Im not done here yet.
Some are never happy.
X, around these parts we call them " big boys pants" don't blaim other for your decisions. Period and full Stop.
Do you know you idiotic you sound. Do you actually think MM's are taking massive short positions in a stock that is one step away from exploding with an agreement. The number one blame lies with the management teams that were flat out liars. Your idol Lebby was a joke in the past few years and shareholders got taken to the cleaners because of his false promises. No one doubted his scientific exploits but he was a disaster as a CEO and now this company has zero credibility.
Do you know the meaning of the word 'love'?
Yea has to be manipulation. It couldn't be that they are incapable of getting contracts signed or generating revenue. The business man with all the big connections cannot sell the best polymer out there ?? 🤣🤣🤣🤣
WASH RINSE REPEAT with every new CEO.
Give him time 🤣🤣🤣like we did with Marcelli and Lebby??🤡🤡🤡
The rallying cry of every criminal Short and cynical Basher:
"This company sucks!! get out now before it goes to zero in another year or two. This thing is going to be a disaster. Don't trust management and give them the boot. There is no right time, sell now!!!!"
So, which one are you? criminal Short? Or cynical Basher?
Those are your only two options if you're making statements like that.
Hey basher boy, instead of posting your pure BS why not explain why TFLN has a snowball's chance in hell against LWLG Polymers!! here's the FACTS
Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers
Performance
Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)
LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)
Integration
Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)
LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost
Processing
Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.
LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc
Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
Just like you, nobody knows the top and nobody knows the bottom
The rallying cry of every naive investor and cyncial pumper:
"This company is a gold mine! We just need to be patient and give it more time. Just another year or two. This thing is going to be huge. Trust management and give them more time to execute. We're in the right place at the right time!!!!"
So, which one are you? Naive investor? Or cyncial pumper?
Those are your only two options if you're making statements like that.
Total BS low volume high frequency manipulation games going on here today once again it just never ends!!!!
Short Interest rose about 2 million shares in the last 2 weeks from about 19.6 million to 21.2 million more shares Shorted, meanwhile in that same period of time the PPS rose from about 0.90 to 1.30, wow, the Shorts must be in trouble if that is the case!!
https://shortsqueeze.com/?symbol=lwlg&submit=Short+Quote%E2%84%A2
If there is any Institutional forced selling that is not negated by Institutions Short shares forced callbacks, those shares will be sopped up by MM's to Cover their Naked Shorting games of the past handful of years here, once MM's clear their books, they will guaranteed be sure to run this up to force the Shorts to Cover, which will be IMPOSSIBLE at any price under $20, Longs will NEVER give up 20 MILLION shares that Shorts NEED to Cover!!!
People here have invested a lot of time and "deserve" a great return on the time and the money invested. Now you seem short on patience. It can be good or bad. I wish you the best for you.
You already had 10 you even had very close to 20..... Why aren't you and your kids set for life?
While the shorts/naysayers would prefer that we all look in the rearview mirror, the smart money will be looking ahead. It is true that in the past the industry was not ready for the performance benefits of Perkinamine. There was no urgency for a paradigm shift, and LWLG leadership misread the room. That has now changed on multiple fronts, including the new leadership in Yves. I have not been here as long as many, so I'm still very patient, but I fully believe we are in the right place, and finally at the right time!
Just think of this: we're close to setting a World Record, in gapping up in price. Pretty soon.
Wait for what? A bird in hand...... just saying, we've been treading water for decades. Personally 15 years in. I'm ready for a buyout and moving onto something new. 10$ a share and I'm set for the rest of my days, 20$ a share and my kids are set. Bring it already I say
Don't forget that the company issued a press release in December 2023 indicating that they expected to close several Tier 1 deals possibly as soon as December 31st.
That means that the only thing "the Get Er Done Gang" had to do was finalize all those "deals" that were "on the verge of closing" more than 1.5 years ago.
Strange, isn't it, that no deals have materialized.
Almost as if the company was knowingly misleading shareholders and knowingly feeding them a load of BS.
Unfortunately, the cheerleaders were only too happy to switch off their brains rather than asking tough questions and holding management accountable. Which is exactly why the stock is trading for slightly less than a candy bar.
Foxconn is Taiwan and China. That's big. Very big. I hope Yves is not thinking of selling too soon. The water is just starting to bubble. Wait another year or two.
listen at 22 minute for 1 minute to hear Yves say "there's no hard rules but18 months to 2 years is what it takes from beginning to getting to that production stage, from Stage 1 to Stage 4"
Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers
Performance
Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)
LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)
Integration
Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)
LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost
Processing
Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.
LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc
Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
When is The Get'er Done Gang going to get something done??
6 months now and no deals. Thought they said a perk supply contracts would be much easier than a Teir1 deal.
Short Interest rose about 2 million shares in the last 2 weeks from about 19.6 million to 21.2 million more shares Shorted, meanwhile in that same period of time the PPS rose from about 0.90 to 1.30, wow, the Shorts must be in trouble if that is the case!!
https://shortsqueeze.com/?symbol=lwlg&submit=Short+Quote%E2%84%A2
If there is any Institutional forced selling that is not negated by Institutions Short shares forced callbacks, those shares will be sopped up by MM's to Cover their Naked Shorting games of the past handful of years here, once MM's clear their books, they will guaranteed be sure to run this up to force the Shorts to Cover, which will be IMPOSSIBLE at any price under $20, Longs will NEVER give up 20 MILLION shares that Shorts NEED to Cover!!!
iBorrow available to Short has dropped, and the rate shot up to 13%, if Yves drops a Tier 1 deal it's GO TIME and Shorts will be TOAST!!
https://www.iborrowdesk.com/report/LWLG
Stay calm..... forced callbacks by the supertankers Vanguard and Blackrock who own combined close to 20 MILLION shares should be no problem for the Shorts, they will just need to PRY those shares out of the hands of the Longs who are NEVER going to give up the shares!!! watch and learn!!
did Institutions already begin to flip the manipulation script? did Shorts bite the hand that fed them? sure looks like it!! Vanguard and Blackrock DON'T LIKE TO LOSE!!! and each of them own close to 10 MILLION shares apiece and their average purchase price is around $8 slightly above the 5 year VWAP near $7, Will there be "forced callbacks" of 20 MILLION Shorted shares? It sure looks like Institutions are beginning to flip the script on the Shorts already!!
1) 21 MILLION SHARES SHORTED
2) ALMOST 20 MILLION SHARES HELD BY VANGUARD AND BLACKROCK COMBINED
Shorts best hope is SCENARIO #1 of these only two possible scenarios, in either case it would be in the best interest of the Shorts to Cover all the shares they can right now ahead of EITHER of these two scenarios playing out
Scenario #1 after Yves inks a Tier 1 deal or two in the next 2 months before final decisions, and the PPS moves up to the $3-$5 range before the final decisions day of adds/deletes that LWLG will not be deleted
Scenario #2 let's say LWLG would be a delete from the index, everybody here knows that it was the Institutions (read Vanguard & Blackrock who don't like to lose!!) that LOANED the shares to the Shorts!!! So do you really think the Institutions are going to be the ones to take the hit dumping their shares at rock bottom prices to aid the criminal Shorts? NO WAY!!! Here's what would happen, the Institutions would call back their loaned shares and watch as the Shorts try and find 20 million shares to Cover, good luck with that!!!! this is why it has held 100% true that the Shorts would never get a volume capitulation from the Longs!!! the criminal Shorts and MM's have been using low volume high frequency manipulation games here routinely for many months!!! So only after the Shorts be forced to Cover by the Institutions driving the share price higher, and then the Institutions would be able to sell their shares unharmed!! That's the way it would work, so Shorts better hope LWLG is NOT going to be a deletion!!!
How quickly would the Shorts be forced to Cover in the event of Scenario #2? from AI on the topic here
General Timeframes:
While there's no strict regulatory standard for recall notice periods, here are some general expectations:
Short Notice (Urgent Recall): In some situations, especially due to client sales, short sellers might only receive notice within the trading day or be required to return the shares by the next day. This can lead to forced buy-ins if the short seller cannot locate shares quickly.
Standard Recall: For less urgent reasons, the notice period is typically a few business days (e.g., 2-5 days). This allows the short seller some time to repurchase the shares in the market.
Longer Notice (Less Common): In certain circumstances, the notice period could be longer, but this is less typical for standard recalls.
Important Considerations for Short Sellers:
Recall Risk: Short sellers always face the risk that the borrowed shares will be recalled. This is an inherent risk of short selling and should be factored into their trading strategy
Again, GOOD LUCK to the Shorts on purchasing 20 MILLION Shares in the open market once the FORCED CALL BACK of the loaned shares by Institutions (Vanguard & Blackrock) occurs!!!
I'm sure they will all fall in line after your request. C'mon man, really?
writing is on the wall for upcoming Tier 1 deal, frankly it's likely Nvidia and TSMC in the works, why else would LWLG be establishing a Sales and Marketing arm in Asia currently!!
Is LWLG working with TSMC/Nvidia on their Next-gen technology project in Taiwan? the following are reasons why this may quite likely be the case!!
- Yves recent Asia trip included a stop in Taiwan coincident with recent collaborations of TSMC and Nvidia
- Yves spending the first 5-10 minutes of the 2025 ASM on Nvidia's new strategy, you can watch the 2025 ASM replay here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176203906
- Tom saying LWLG is now Establishing Sales and Distribution channels in Asia, why would this be being done now if there was not a need for it developing for LWLG's technology in Asia currently
- Eoptolink and Foxconn added to Yves 2025 ASM presentation after his recent trip to Taiwan, obviously one would assume he met with TSMC
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf
- SemiVision articles tagging LWLG along with TSMC and Nvidia
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176198177
-Nvidia in GTC 2025 Keynote disclosing they will be using MRR's in their next-generation technology, and it has been proven that LWLG's technology is the solution to the issues that silicon MRR's have with temperature sensitivity that require individual temperature IC's for each and every MRR!!! read all about it in this post of mine
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176202947
- Nvidia Patents including Polymers as materials being used
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176159796
- the Lebby exchange with Nvidia VP of R&D who commented directly back to Lebby "some startups are clinging too tightly to their IP" Note: perhaps this is the actual reason Lebby was replaced by Yves, Lebby likely was being too controlling in relationship developing the devices in-house where the recent LWLG shift in business strategy in now allowing the Customer to control the device developments with LWLG technical support and PDK's available to them as needed
- 2024 ASM slides 13 and 14 including the quote from Nvidia executive
----- Quote from Slide 13 >> “in many ways polymers will be an ideal enabler of the growth expected in Infiniband usage”
----- Infiniband is a key enabler for NVIDIA à higher speeds are required now
----- Slide 14 showing the Infiniband Roadmap showing how LWLG would be able to enable with their Polymers
- Jim's 2024 ASM comment regarding working with Nvidia
- Yves LeMaitre asked $LWLG shareholders to do some homework and watch the GTC 2025 hardware presentation of Jensen Huang on copacked optics. Because presentations can be long, Steve Schiets made an AI podcast with NotebookLM. Great listen, imo.
https://www.linkedin.com/posts/steve-schiets-1016aa21_ai-photonics-cpo-activity-7329210816216403968-StF4/
Marco commented, This podcast summary of what came out of Jensen"s Huang's talk on co-packaged optics is absolutely great! It pieces together what Nvidia wants and sees the industry moving towards while pointing out the things that will allow LWLG's polymers to meet the checklist of requirements without each company talking about the other. A match made in heaven so to speak. The critical concept of moving the optics as close as possible to the compute functions can be facilitated using polymers as part of the device configuration. Accomplishing this either using tiny MRRs with polymers inside or using co-packaged optics with polymers incorporated the goal is obtained. Either way, it looks like Lightwave's polymers will become critical enablers of the marriage of optics and compute.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176202918
To those sharing/spreading articles on ihub and reddit--please include if the publishers are paid by lightwave or lightwave's PR/IR firm to mention lightwave.....because I'm pretty sure the articles spread over the last two days are paid industry pump pieces......which makes you desperate pumpers. (I'm sure several of you know and are in on it)
P.S. RReagan and the rest of you gambling call option buyers--all those options are gonna expire worthless. It's hilarious that you thought Yves was gonna get a deal done in six months.
Hammertime--this is more of a scold and teaching moment, than a request, but hey, you might understand sooner or later...
Time is ticking until more and more people realise that a market cap of ~ 200mio for this company is a huge buying opportunity.The market starts begging now to progress with E.O. from us!!Soon we will pass the first Billion, from there on we lift off 🚀 into serious valuation space!
From Foxcon
In the midst of this technological revolution, Lightwave Logic, Inc., has emerged as a major focal point. Lightwave Logic is dedicated to developing and commercializing next-generation high-performance electro-optic (EO) polymer materials, aiming to significantly enhance data transmission rates and energy efficiency for data centers and telecommunications networks, with a special focus on high-speed data exchange scenarios required by generative artificial intelligence (Generative AI).
Lightwave Logic’s core technology is its proprietary Perkinamine® electro-optic (EO) polymer platform. This material offers key advantages including a high electro-optic coefficient (r33), low power consumption, and high-frequency response, making it suitable for manufacturing electro-optic modulators that can efficiently convert electrical signals into optical signals at extremely high speeds.
These capabilities enable data transmission rates exceeding 400 Gbps, with scalability toward 800 Gbps, 1.6 Tbps and 3.2Tbps platforms. Such platforms are aimed at supporting the next generation of large-scale generative AI data center clusters and campus network architectures, laying the foundation for future interconnect demands
Lightwave Logic adopts a business model based on technology licensing and co-development, entering into non-disclosure agreements (NDAs) with Tier-1 and Tier-2 strategic partners to jointly evaluate the application potential of its EO polymer technology across data center equipment, optical modules, and CPO (Co-Packaged Optics) platforms.
The company is committed to providing solutions that are simple and compatible with existing semiconductor wafer fabrication processes, with the goal of reducing the power consumption of thousands of optical components through advanced materials, while offering a sustainable evolutionary path for future bandwidth upgrades such as 3.2 Tbps and 6.4 Tbps, thus avoiding the high costs and risks traditionally associated with system upgrades.
In terms of enabling commercial deployment, Lightwave Logic has introduced a Process Design Kit (PDK) compatible with silicon photonic integrated circuits, successfully achieving seamless integration of its Perkinamine® materials with existing semiconductor manufacturing workflows.
The company has demonstrated the practicality and manufacturability of this PDK through collaborations with two semiconductor foundries, laying a strong foundation for commercializing EO polymer technology and enabling large-scale production.
Meanwhile, Lightwave Logic has also established collaborations with institutions such as ETH Zurich and Polariton Technologies to co-develop plasmonic Mach-Zehnder modulators (Plasmonic MZMs) based on EO polymers.
These modulators have already demonstrated single-channel transmission rates exceeding 1.6 Tbps. This achievement not only validates the technical feasibility of EO polymers for ultra-high-speed applications but also positions Lightwave Logic as one of the most closely watched emerging material suppliers in the fields of CPO and next-generation high-speed optical modules.
Against the backdrop of the rapid advancement of high-speed optical communication technologies, electro-optic (EO) polymer technology is increasingly emerging as a key enabler for upgrading data centers and artificial intelligence infrastructure. Particularly at the OFC50 conference, the industry engaged in in-depth discussions regarding the potential of EO polymers in 400G/lane and co-packaged optics (CPO) applications, as well as the future challenges that high-frequency modulators might face.During this major technical event, Lightwave Logic, a technology company based in Englewood, Colorado, attracted widespread attention.
Good for you. Time will tell.
..
" The company (Lightwave Logic) demonstrated the practicality and manufacturability of this PDK through collaborations with two semiconductor foundries, laying a strong foundation for commercializing EO polymer technology and enabling large-scale production."
Mark L even takes shots at TSMC’s plans to do CPO. No wonder he is skeptical of a startup like LWLG who has never sold a product. He is skeptical of the largest foundry in the world that they’ll never sell a silicon photonics product.
How seriously should one take TSMC’s involvement with silicon photonics/co-packaged optics (please see: https://lnkd.in/eCqm33-6)? The initial news out of Taiwan appeared to suspiciously come out just before New Year’s Day, when it would presumably get an inadequate amount of attention. Earlier in 2024, this writer told an exec at TSMC that it would not be surprising if that firm drags its feet indefinitely on SiPh. The person just laughed and said, "No comment." In 2025, there have also been large market research firms, which are not historically known for their courage, either making jokes about CPO or going out of their way to attack any speculation of extensive volume at Nvidia in the near term. (It would have been more helpful to be so diligent, when it was not as fashionable to be critical of the concept, when transceiver suppliers were forced to unnecessarily devote extensive resources, about seven years ago -- please see: https://lnkd.in/eENWZGE). Most critically, this latest plan does not represent TSMC’s first effort in SiPh, and the lack of progress previously involved three factors at the corporation: 1) if you put together all of the optics wafers together (not just SiPh), they would only fill up a little more than half of its smallest fab; 2) not getting the necessary leadership in place to pull it off; and 3) its setup heavily favors electronics chip production. The difference this time is that an important customer, Nvidia, is requesting TSMC’s involvement. Nvidia anticipates that the market will move to "beyond CPO", -- the close coupling of SiPh with CMOS chips on the same substrate, which would permit TSMC to produce the full assembled system. Yet, fibeReality agrees with the point of view that although volume at least theoretically demanded by the former would make it more appealing to the latter, that solution will likely never approach being a substantial business.
https://www.linkedin.com/posts/mark-lutkowitz-b22abb2_how-seriously-should-one-take-tsmcs-involvement-activity-7340416257155821568-8kVX/
Thank you for the “ revealing” article. It largely confirms the opportunity we believe Lightwave offers. Nice to hear it from as far as Taiwan and from the manufacturing ( and R&D) center of “US” Tier 1 manufacturing (and to understand Lightwave’s material EUV lithography compatibility) .
He was the last insider to buy. Honestly I wish that every employee would not only work there but take out loans and buy shares increasing the float though. I'm sure every investor here does the same thing where they work. I have to admit that as an employee I took the vested options and stayed as diversified as possible.
X
Excellent, this beta android ihub software app prevents me from easily grabbing the info and posting, but the answers are there.
X. Beta versions suck.
A bit disappointing. A great opportunity for him to buy outright and show some confidence. He did not take it.
Form 4's are always tricky to read. Looks like Zelibor had Restricted stock "vest" so instead of selling on the market he just had those 9,888 shares returned to the company. If he thought it was going down he would have cashed it in and sold.
See reference Code F in block 3 then see the legend
"withheld by Issuer to satisfy tax withholding obligation on vesting of restricted stock"
As info the "issuer" is LWLG
9,888 back to the company less "dilution" that way. I think he earned about 35,000 shares which is peanuts.
X He did not Sell. Tis a yawner
I wouldn't say Mark is liar but he appears to put his figure on the scale at times. Talented word smiths can say something one way and cover their butt with either outcome. Kinda the same thing Ted tries to do to appear right with erasor words no matter the outcome.
X that word gets thrown around a lot today.
All of the price action since then has been to supress and accumulate.
The move that is incoming was Decided in December of 2024.
All of the price action since then has been to supress and accumulate.
See you on the other side.
Marketmakers are part of the scam.
How is it possible to trade for over 3 hours at 6.97% without the slightest move...?? If the stockmarket really is at that level of manipulation or fraud, how can we trust this system any longer? It was already low but this....
All I know is it is coiled up. Just need more pressure on the buy side.
MANIPULATION GAME !!!
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The need for Lightwave Logic’s proprietary electro-optic polymers is more evident than at any prior point in history, with internet infrastructure coming under increasing strain due to increased online activity. For example, during the recent COVID-19 pandemic, leading platforms such as YouTube prevented high-definition (HD) streaming in Europe due to data throughput issues in existing internet infrastructure.
The Company’s current focus is on the datacom and telecommunications hardware supply chain for the 100 Gbps and 400 Gbps fiber optics communications market, seeking to integrate its proprietary materials into the devices that comprise key components in today’s internet infrastructure. Lightwave Logic’s unique value proposition, including ease of manufacture relative to traditional solutions, has driven several tier-1 and tier-2 potential strategic partners in the data and telecommunications markets to enter into non-disclosure agreements (NDAs) with Lightwave Logic to evaluate its technology for use in their devices, validating the demand for the Company’s solution in the marketplace. The Company expects to introduce its technology into the commercial marketplace in the near future.
Lightwave Logic is a wholly U.S.-based company with in-house materials synthesis, device/package design, wafer fabrication and testing capabilities at its Englewood, Colorado headquarters.
Having the modulator and integrated circuit development in-house has informed the materials development direction and vice versa. This vertically integrated business model enables a superior platform by aligning the design for manufacturability from materials to complex circuits with the following benefits:
Materials are called electro-optic when they enable interactions between applied electric fields and light passing through them. Notably, they change the refractive index seen by the light with minimum loss. The result is an instantaneous and accurate conversion of an electrical signal to an optical signal. Optical signals are better for transmission over distance: an increasingly useful feature as digital signal speeds are now reaching the GHz and THz ranges and the corresponding electrical transmission distances are shrinking to meters and centimeters.
EO polymers are intrinsically superior in speed and sensitivity to electric field to traditional electro-optic materials such as Lithium Niobate, Indium Phosphide and Silicon. They are engineered materials, made by embedding a variety of specially designed electro-optic chromophore molecules into a wide range of standard host polymers.
Chromophores are complex, large molecules, on a scale akin to drug molecules. They are hyperpolarizable, meaning their electron clouds are easily pulled into a different shape by the applied electric field, changing their optical properties such as index of refraction.
The material is poled to become electro-optic by applying a strong electric field along with heat. The hot material is relatively soft, allowing the chromophore molecules suspended in the host polymer to align in the same direction (poling). Cooling the poled material after the molecules are in place traps them in their active state even after the poling field is removed.
Although the electrons in the material respond to any applied electric field, they remain tightly bound to the molecule. The response to an applied signal is almost instantaneous response and recovery– like that of a tight spring– unlike materials that involve much slower macroscopic movement of free electrons.
Another key difference from traditional crystalline materials is the performance of EO polymers continues to improve as chemists explore the almost unlimited design space. Combinations of chromophores and host polymers can be tailored for specific applications.
In addition to innovating the EO polymer materials, Lightwave Logic takes its technology platform to the next level by developing ancillary materials and processes. These elements are brought together and demonstrated in advanced high-speed optical modulators.
The polymer is spun onto silicon wafers and standard microfabrication techniques are used to deposit and pattern metal electrodes and optical waveguides.
One well-known optical modulator device is the Mach-Zehnder interferometer. The light output is changed by changing the relative phase between the two arms. One common trick to double the effect for the same available drive voltage is to drive the two arms in opposite directions (push-pull mode). Polymers have an interesting advantage over most other electro-optic materials which are crystalline. The direction of polymer’s electro-optic activity is entirely determined by the direction of the applied poling field. By poling the two arms of the Mach-Zehnder in opposite directions, the resulting device automatically has push-pull operation with a single applied signal.
Once the modulator chip is made, it is packaged for mechanical protection and also to ensure signal quality for electrical and optical connections.
Below is a polymer optical modulator with >60 GHz bandwidth packaged with high-speed electrical connectors and optical pigtails.
Inspired by the remarkable record of integrated microelectronics, the opto-electronics industry has great interest in developing photonic integrated circuits (PICS). Photonics refers to devices that manipulate photons—that is, light—rather than electrons.
Even the best individual devices can be made more functional by integrating many together. Integration has many benefits, the most notable being dramatic improvements in size and cost. Yet, photonic integration has only recently come into the spotlight. The primary applications for photonics used to require stand-alone, high performance components such as used for long-haul telecom.
Now, photonic integration has suddenly come into the spotlight as electronic interconnects struggle to keep up with speed increases of electronic chips. Photonics is being looked at to replace electronics in already highly integrated applications such as chip interconnect. Co-packaging of electronics integrated circuits (ICs) with photonic interconnect, considered unlikely a few years ago, is now viewed by many as inevitable. However, this requirement poses new challenges that are acknowledged as difficult and that new technologies will be required to meet them.
P2IC™ (Polymer Photonic Integrated Circuits) are ideally positioned to be one of these new technologies. Lightwave Logic’s devices are made using conventional wafer-scale processing such as used for microelectronics and therefore similarly capable of being integrated. In addition, the polymer microfabrication processes are compatible with other materials platforms such as Silicon Photonics and Indium Phosphide which are now starting to become more integrated. In particular, the Silicon Photonics ecosystem has recently accepted that its roadmap will include adding more and more materials, each for their specific benefits. EO polymers’ speed and voltage advantages are attractive additions to this ecosystem.
A fiber link sends data from a transmitter to a receiver through an optical fiber cable. Lightwave Logic’s technology can be used to make a data modulator, a central function of the transmitter.
Datacenters and high-performance computing (HPC) are two market segments that demand the very highest speed optical fiber communications. The datacenter fiber communications segment includes applications ranging from connections inside hyperscale datacenters to fiber links between datacenter campuses.
Optical fiber communication is the infrastructure that supports internet content through its entire lifecycle, between businesses, consumers and datacenters. Behind the scenes, massive amounts of data move between computer processors inside datacenters (or inside supercomputers) as content is generated. In addition to these intra-datacenter links, there are also significant datacenter interconnection links between big datacenters to provide flexible capacity and resilience – all of these represent significant addressable market segments for Lightwave Logic’s technology.
Modulator performance limits the speed of the transmitter, which in turn limits the data-carrying capacity of the entire fiber link. EO polymers have superior speed and sharply reduce the electrical power needed to operate the modulators.
Lightwave Logic estimates that in 2019, the total market for opto-electronic components used in the fiber optics market reached a value of ~$26 billion and is forecasted to grow to approximately $80 billion by 2030.
Above: Market forecasts for photonic (electro-optic) components and transceivers used in optical fiber communications. (Source: Oculi LLC)
The growth in the optical fiber communications market is driven by many factors, primarily:
The historic trend has been a migration from text to graphics, followed by still graphics to increasingly high-definition video. On the accessibility front, the introduction of 5G will enable low-cost mobile internet connections at the same, or higher speeds, as today’s home broadband. This trend continues today as users demand more data at all times.
Recently, particularly since the onset of the COVID-19 pandemic, there has been a sharp increase in reliance on video-conferencing services, often replacing in-person meetings. As video conferencing becomes more commonly used, users will continue to demand faster response times to enable no-lag, real-time communications in full HD.
The benefits of EO polymers, such as low power usage, high speed, increased throughput and lower cost make them ideally suited for markets outside of communications as well, including in consumer, media, augmented reality/virtual reality, medical and industrial applications.
Developing, protecting and commercializing intellectual property is central to Lightwave Logic’s identity as a technology company. Lightwave Logic has over 50 U.S. and international patents and applications that are issued or pending.
These patents provide freedom of manufacture for the company’s electro-optic (EO) polymer materials systems and its optical device technology.
Lightwave Logic’s patent portfolio covers the following areas:
The company continuously seeks to innovate new electro-optic chromophores, designing molecular architectures to meet application needs such as high electro-optic activity and stability. We also design ancillary materials that are useful in conjunction with the EO polymers themselves. Example patents within the materials category include:
Publication Number | Title |
---|---|
US Patent 7,902,322 | Nonlinear optical chromophores with stabilizing substituent and electro-optic devices |
US Patent 9,535,215 | Fluorinated Sol-Gel Low Refractive Index Hybrid Optical Cladding and Electro-Optic Devices Made Therefrom |
As the company demonstrates its materials in devices, such as modulators, it has engineered ways to enhance device performance by means of device design and optimized control. Example patents within the optical device category include:
Publication Number | Title |
---|---|
US Patent 10,520,673 | Protection layers for polymer modulators/waveguides |
US Patent 7,738,745 | Method of Biasing and Operating Electr-Optic Polymer Optical Modulators |
Materials innovations are followed by methods in which the Company or its partners can best work with the materials in the fabrication process. Example patents within the fabrication category include:
Publication Number | Title |
---|---|
US Patent Application 20190353843 | Fabrication process of polymer based photonic apparatus and the apparatus |
US Patent 10,591,755 | Direct-drive polymer modulator methods of fabricating and materials therefor |
Polymers can be used to add functionality to existing semiconductor devices, inclusive of making photonic integrated circuits (ICs). Areas of active innovation include how to get light from one material system into another with minimal losses. Example patents within the semiconductor integration category include:
Publication Number | Title |
---|---|
US Patent 10,527,786 | Polymer modulator and laser integrated on a common platform and method |
US Patent 10,511,146 | Guide transition device with digital grating deflectors and method |
Challenges for high-speed optical packaging includes maintaining the quality of radio-frequency electrical signals and hermetic/environmental sealing of devices for durability (while still allowing light to go through). Example patents within the packaging category include:
Publication Number | Title |
---|---|
US Patent 10,574,025 | Hermetic capsule and method for a monolithic photonic integrated circuit |
US Patent 10,162,111 | Multi-fiber/port hermetic capsule sealed by metallization and method |
We cannot assure you that we will meet the conditions of the 2023 Purchase Agreement with Lincoln Park in order to obligate Lincoln Park to purchase our shares of common stock, and we cannot assure you that we will be able to sell any shares under or fully utilize the Roth Sales Agreement. In the event we fail to do so, and other adequate funds are not available to satisfy long-term capital requirements, or if planned revenues are not generated, we may be required to substantially limit our operations. This limitation of operations may include reductions in capital expenditures and reductions in staff and discretionary costs.
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