News 
Market Data 
Discover
Register for free to join our community of investors and share your ideas. You will also get access to streaming quotes, interactive charts, trades, portfolio, live options flow and more tools.
... as my bias has been removed the last few months
https://www.eetimes.com/silicon-photonics-and-co-packaged-optics-shine-a-light-at-ofc-2025/
BTW one of my stocks was up this week the one with billions of shares.
Research it again is my opinion
Regarding lwlg nothing more to say other then it's a big industry so they should be getting a piece of the pie
TFLN has NOT been proven to be scalable!!!
Polymers on the other hand can scale to 200mm Wafers, and almost certainly can scale to 300mm Wafers too!! And the PDK's are at the ready, both front end and back end processes, these are production ready now at multiple Foundries, and EASILY duplicated at other Foundries!!
worth another LQQk, The foundry ecosystem is ready to produce,.our material is much easier than TFLN
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176022015
in Yves Safecapital interview investors learned that the Tier 1 Design-In cycle is "typically 18-24 months" start to finish including 4 distinct phases, of which Yves told investors he is already well into Phases 1 & 2 which is where the Customer engagement generally inks the Design-In deal, so let's see what comes of the Yves interactions at OFC 2025 March 31-April 3, also let's keep in mind that the Design-In cycle may well be shortening now with the onslaught of increased data requirements of AI, here from the 2024 ASM
How long does it take to design in for a datacenter customer Tier1?
Given G-AI, design in cycles have shortened that range from 20-50% depending on each customer. Our flexible business model allows us to work with OEMs, CMs, and their relationships with foundries.
Yves Safecapital interview also confirms what I have theorized and been posting here the whole time since the Business Strategy changed!!
Lebby was taking on a Herculean task in-house with a woefully understaffed Devices team trying to meet the demands of CUSTOM 4x200 PIC's (listen to Yves starting at 14 mins) of several of the world's largest Transceiver makers on 3 Continents, and although he had these Devices in Qualifications, they were not completed when the Strategy shift occurred, so presumably those Tier 1's were given a head start over the Partners/Customers targeted "from scratch" some of which may have been Tier 1's that Lebby "put on hold" when he was picking and choosing what he called his "Freindly's after the overwhelming success of LWLG 200Gbs modulators on 200mm Wafers with EXCEEDINGLY HIGH YIELDS!!!!
so who are the new Partners/Customers? read my post here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=175964182
Nobody was fired like the Shorts want you to believe, these "Integrated Devices" will now be built by MANY companies who do this kind of thing everyday, it's their business after all!!!
The PkM materials have ZERO issues with Reliability & Stability!!!! The Industry has accepted this now already!!!!
Listen to Yves discuss all of this in this interview!!
Do tariffs help or hurt TFLN-based PIC designers?
Seems crazy to put all your eggs in that basket.
Couldn't agree more. Why is everyone here in denial? It is so obvious that LWLG is done.
Vaporware
Good post, I'm not sure that some understand that until the beginning of last week, LWLG was only offering perkinamine to a very select few, so of course the industry is going to try and work with what it had and yes they presented what they had done with the materials available to them. Except for private meetings no one knew m7ch about Lightwaves PDKs that they are now making available to be applied in foundries, for designing in, and as you point out NVDA is a prime example of publicly requesting solutions.
Still say that we get bought out.
X
what is key in the Nvidia announcement this week, lies in the fact, that for the very first time, a leading worldwide conglomerate, along with other partners ($TSMC, $INTC... ) is recognizing the value of photonics in reducing the power use that is constraining the amount of work new #AIFactories can accomplish!
Now, a corollary of this statement, implies that photonics be compatible with CMOS foundries, to meet the volume targets demanded by the industry. The bottlenecks today are not in designing and prototyping (you will see many announcements at OFC25 for #200G/L, even #400G/L ) but in packaging and testing those components at scale (this was the call from Nvidia's Seyedi at Optica PECC conference last November).
Of course, existing base materials, are going to fight like hell to delay when they are kicked out of designs, but the true cost of ownership of the solutions they are introducing is torpedoed by the reliance on various amounts of DSP (Digital Signal Processing: extra power hungry components on the transceivers chips), by the reliance on multiplying the number of lanes (8-lanes, 16-lanes...), which are also incompatible with the power restrictions mentioned above.
The value of $LWLG Perkinamine TM, lies in its core molecular make up:
- It modulates light really fast (holds a world record along with Polariton Plasmonics, into the TeraHerz)
- It saves power to do so: claims up to 90% power saving vs competing solutions
- It is fully compatible with the CMOS chip manufacturing environment: see the PDK portfolio that was achieved in collaboration with the Singapore based Photonic foundry AMF (PR in May'24).
- It is so compact, it saves a lot of real estate on the chip, making room for the designers to pack in more features, if they so desire...
As a start-up, Lightwave Logic had to recently adjust its go-to-market strategy to reach a wider audience, but don't you think Nvidia, along with all the other players in the AI race who recently announced they are launching their proprietary solutions (AMD, Apple, Google, Amazon... along with their various suppliers: Broadcom, Cisco, Marvell, Lumentum, Coherent...) are going to rapidly make use of any solution that gives them an edge? The recent strategy adjustment has a huge benefit: it places the development costs on the competitors in this cutthroat environment.
That's why Yves was brought in, in this commercial race: to make sure that starting in 2025 and 2026, Lightwave Logic gets its fair share of the up to $2.5B serviceable market in which modulators could claim up to 25% of the value at higher speeds!!
Looking forward to what the coming months are going to unveil...
GLTAL
AR.
https://www.reddit.com/r/LWLG/comments/1jfz0yg/jensen_huang_nvidia_silicon_photonics/
Polariton interview says Plasmonics 400gbs lanes will scale by 2027, they could be the dominant force because they are the only technology that can scale speeds in excess of 1Tb for single lanes in the future, so why not be adopted in 2027
Polariton 1THz modulators can scale!!! listen to the interview, only minor engineering left to be done!!! the science is PROVEN!!! with LWLG INSIDE!!!! Listen starting at 8 minutes Polariton will be the FIRST to have production volumes at 400Gbs lanes, and can extend to speeds in excess of 1Tbs lanes!!! with LWLG INSIDE!!!!
https://picmagazine.net/video/610/Record-breaking_bandwidth_of_1.1_THz_for_plasmonic_modulators
Nokia and @googlecloud are teaming up to revolutionize energy efficiency in telecom networks.
Nokia and @googlecloud are teaming up to revolutionize energy efficiency in telecom networks.
— Nokia (@nokia) March 20, 2025
Watch the interview from #MWC25 to learn how this partnership helps reduce energy consumption, optimize network performance, and accelerate the journey toward Autonomous Networks:… pic.twitter.com/spHZHtYUha
worth another LQQk, The foundry ecosystem is ready to produce,.our material is much easier than TFLN
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=176022015
in Yves Safecapital interview investors learned that the Tier 1 Design-In cycle is "typically 18-24 months" start to finish including 4 distinct phases, of which Yves told investors he is already well into Phases 1 & 2 which is where the Customer engagement generally inks the Design-In deal, so let's see what comes of the Yves interactions at OFC 2025 March 31-April 3, also let's keep in mind that the Design-In cycle may well be shortening now with the onslaught of increased data requirements of AI, here from the 2024 ASM
How long does it take to design in for a datacenter customer Tier1?
Given G-AI, design in cycles have shortened that range from 20-50% depending on each customer. Our flexible business model allows us to work with OEMs, CMs, and their relationships with foundries.
Yves Safecapital interview also confirms what I have theorized and been posting here the whole time since the Business Strategy changed!!
Lebby was taking on a Herculean task in-house with a woefully understaffed Devices team trying to meet the demands of CUSTOM 4x200 PIC's (listen to Yves starting at 14 mins) of several of the world's largest Transceiver makers on 3 Continents, and although he had these Devices in Qualifications, they were not completed when the Strategy shift occurred, so presumably those Tier 1's were given a head start over the Partners/Customers targeted "from scratch" some of which may have been Tier 1's that Lebby "put on hold" when he was picking and choosing what he called his "Freindly's after the overwhelming success of LWLG 200Gbs modulators on 200mm Wafers with EXCEEDINGLY HIGH YIELDS!!!!
so who are the new Partners/Customers? read my post here
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=175964182
Nobody was fired like the Shorts want you to believe, these "Integrated Devices" will now be built by MANY companies who do this kind of thing everyday, it's their business after all!!!
The PkM materials have ZERO issues with Reliability & Stability!!!! The Industry has accepted this now already!!!!
Listen to Yves discuss all of this in this interview!!
|
Followers
|
741
|
Posters
|
|
|
Posts (Today)
|
1
|
Posts (Total)
|
214784
|
|
Created
|
01/06/07
|
Type
|
Free
|
| Moderators pochemunyet x993231 Pro_v12001 LOVELWLG JLPTNG KCCO7913 | |||
The need for Lightwave Logic’s proprietary electro-optic polymers is more evident than at any prior point in history, with internet infrastructure coming under increasing strain due to increased online activity. For example, during the recent COVID-19 pandemic, leading platforms such as YouTube prevented high-definition (HD) streaming in Europe due to data throughput issues in existing internet infrastructure.
The Company’s current focus is on the datacom and telecommunications hardware supply chain for the 100 Gbps and 400 Gbps fiber optics communications market, seeking to integrate its proprietary materials into the devices that comprise key components in today’s internet infrastructure. Lightwave Logic’s unique value proposition, including ease of manufacture relative to traditional solutions, has driven several tier-1 and tier-2 potential strategic partners in the data and telecommunications markets to enter into non-disclosure agreements (NDAs) with Lightwave Logic to evaluate its technology for use in their devices, validating the demand for the Company’s solution in the marketplace. The Company expects to introduce its technology into the commercial marketplace in the near future.
Lightwave Logic is a wholly U.S.-based company with in-house materials synthesis, device/package design, wafer fabrication and testing capabilities at its Englewood, Colorado headquarters.
Having the modulator and integrated circuit development in-house has informed the materials development direction and vice versa. This vertically integrated business model enables a superior platform by aligning the design for manufacturability from materials to complex circuits with the following benefits:
Materials are called electro-optic when they enable interactions between applied electric fields and light passing through them. Notably, they change the refractive index seen by the light with minimum loss. The result is an instantaneous and accurate conversion of an electrical signal to an optical signal. Optical signals are better for transmission over distance: an increasingly useful feature as digital signal speeds are now reaching the GHz and THz ranges and the corresponding electrical transmission distances are shrinking to meters and centimeters.
EO polymers are intrinsically superior in speed and sensitivity to electric field to traditional electro-optic materials such as Lithium Niobate, Indium Phosphide and Silicon. They are engineered materials, made by embedding a variety of specially designed electro-optic chromophore molecules into a wide range of standard host polymers.
Chromophores are complex, large molecules, on a scale akin to drug molecules. They are hyperpolarizable, meaning their electron clouds are easily pulled into a different shape by the applied electric field, changing their optical properties such as index of refraction.
The material is poled to become electro-optic by applying a strong electric field along with heat. The hot material is relatively soft, allowing the chromophore molecules suspended in the host polymer to align in the same direction (poling). Cooling the poled material after the molecules are in place traps them in their active state even after the poling field is removed.
Although the electrons in the material respond to any applied electric field, they remain tightly bound to the molecule. The response to an applied signal is almost instantaneous response and recovery– like that of a tight spring– unlike materials that involve much slower macroscopic movement of free electrons.
Another key difference from traditional crystalline materials is the performance of EO polymers continues to improve as chemists explore the almost unlimited design space. Combinations of chromophores and host polymers can be tailored for specific applications.
In addition to innovating the EO polymer materials, Lightwave Logic takes its technology platform to the next level by developing ancillary materials and processes. These elements are brought together and demonstrated in advanced high-speed optical modulators.
The polymer is spun onto silicon wafers and standard microfabrication techniques are used to deposit and pattern metal electrodes and optical waveguides.
One well-known optical modulator device is the Mach-Zehnder interferometer. The light output is changed by changing the relative phase between the two arms. One common trick to double the effect for the same available drive voltage is to drive the two arms in opposite directions (push-pull mode). Polymers have an interesting advantage over most other electro-optic materials which are crystalline. The direction of polymer’s electro-optic activity is entirely determined by the direction of the applied poling field. By poling the two arms of the Mach-Zehnder in opposite directions, the resulting device automatically has push-pull operation with a single applied signal.
Once the modulator chip is made, it is packaged for mechanical protection and also to ensure signal quality for electrical and optical connections.
Below is a polymer optical modulator with >60 GHz bandwidth packaged with high-speed electrical connectors and optical pigtails.
Inspired by the remarkable record of integrated microelectronics, the opto-electronics industry has great interest in developing photonic integrated circuits (PICS). Photonics refers to devices that manipulate photons—that is, light—rather than electrons.
Even the best individual devices can be made more functional by integrating many together. Integration has many benefits, the most notable being dramatic improvements in size and cost. Yet, photonic integration has only recently come into the spotlight. The primary applications for photonics used to require stand-alone, high performance components such as used for long-haul telecom.
Now, photonic integration has suddenly come into the spotlight as electronic interconnects struggle to keep up with speed increases of electronic chips. Photonics is being looked at to replace electronics in already highly integrated applications such as chip interconnect. Co-packaging of electronics integrated circuits (ICs) with photonic interconnect, considered unlikely a few years ago, is now viewed by many as inevitable. However, this requirement poses new challenges that are acknowledged as difficult and that new technologies will be required to meet them.
P2IC™ (Polymer Photonic Integrated Circuits) are ideally positioned to be one of these new technologies. Lightwave Logic’s devices are made using conventional wafer-scale processing such as used for microelectronics and therefore similarly capable of being integrated. In addition, the polymer microfabrication processes are compatible with other materials platforms such as Silicon Photonics and Indium Phosphide which are now starting to become more integrated. In particular, the Silicon Photonics ecosystem has recently accepted that its roadmap will include adding more and more materials, each for their specific benefits. EO polymers’ speed and voltage advantages are attractive additions to this ecosystem.
A fiber link sends data from a transmitter to a receiver through an optical fiber cable. Lightwave Logic’s technology can be used to make a data modulator, a central function of the transmitter.
Datacenters and high-performance computing (HPC) are two market segments that demand the very highest speed optical fiber communications. The datacenter fiber communications segment includes applications ranging from connections inside hyperscale datacenters to fiber links between datacenter campuses.
Optical fiber communication is the infrastructure that supports internet content through its entire lifecycle, between businesses, consumers and datacenters. Behind the scenes, massive amounts of data move between computer processors inside datacenters (or inside supercomputers) as content is generated. In addition to these intra-datacenter links, there are also significant datacenter interconnection links between big datacenters to provide flexible capacity and resilience – all of these represent significant addressable market segments for Lightwave Logic’s technology.
Modulator performance limits the speed of the transmitter, which in turn limits the data-carrying capacity of the entire fiber link. EO polymers have superior speed and sharply reduce the electrical power needed to operate the modulators.
Lightwave Logic estimates that in 2019, the total market for opto-electronic components used in the fiber optics market reached a value of ~$26 billion and is forecasted to grow to approximately $80 billion by 2030.
Above: Market forecasts for photonic (electro-optic) components and transceivers used in optical fiber communications. (Source: Oculi LLC)
The growth in the optical fiber communications market is driven by many factors, primarily:
The historic trend has been a migration from text to graphics, followed by still graphics to increasingly high-definition video. On the accessibility front, the introduction of 5G will enable low-cost mobile internet connections at the same, or higher speeds, as today’s home broadband. This trend continues today as users demand more data at all times.
Recently, particularly since the onset of the COVID-19 pandemic, there has been a sharp increase in reliance on video-conferencing services, often replacing in-person meetings. As video conferencing becomes more commonly used, users will continue to demand faster response times to enable no-lag, real-time communications in full HD.
The benefits of EO polymers, such as low power usage, high speed, increased throughput and lower cost make them ideally suited for markets outside of communications as well, including in consumer, media, augmented reality/virtual reality, medical and industrial applications.
Developing, protecting and commercializing intellectual property is central to Lightwave Logic’s identity as a technology company. Lightwave Logic has over 50 U.S. and international patents and applications that are issued or pending.
These patents provide freedom of manufacture for the company’s electro-optic (EO) polymer materials systems and its optical device technology.
Lightwave Logic’s patent portfolio covers the following areas:
The company continuously seeks to innovate new electro-optic chromophores, designing molecular architectures to meet application needs such as high electro-optic activity and stability. We also design ancillary materials that are useful in conjunction with the EO polymers themselves. Example patents within the materials category include:
| Publication Number | Title |
|---|---|
| US Patent 7,902,322 | Nonlinear optical chromophores with stabilizing substituent and electro-optic devices |
| US Patent 9,535,215 | Fluorinated Sol-Gel Low Refractive Index Hybrid Optical Cladding and Electro-Optic Devices Made Therefrom |
As the company demonstrates its materials in devices, such as modulators, it has engineered ways to enhance device performance by means of device design and optimized control. Example patents within the optical device category include:
| Publication Number | Title |
|---|---|
| US Patent 10,520,673 | Protection layers for polymer modulators/waveguides |
| US Patent 7,738,745 | Method of Biasing and Operating Electr-Optic Polymer Optical Modulators |
Materials innovations are followed by methods in which the Company or its partners can best work with the materials in the fabrication process. Example patents within the fabrication category include:
| Publication Number | Title |
|---|---|
| US Patent Application 20190353843 | Fabrication process of polymer based photonic apparatus and the apparatus |
| US Patent 10,591,755 | Direct-drive polymer modulator methods of fabricating and materials therefor |
Polymers can be used to add functionality to existing semiconductor devices, inclusive of making photonic integrated circuits (ICs). Areas of active innovation include how to get light from one material system into another with minimal losses. Example patents within the semiconductor integration category include:
| Publication Number | Title |
|---|---|
| US Patent 10,527,786 | Polymer modulator and laser integrated on a common platform and method |
| US Patent 10,511,146 | Guide transition device with digital grating deflectors and method |
Challenges for high-speed optical packaging includes maintaining the quality of radio-frequency electrical signals and hermetic/environmental sealing of devices for durability (while still allowing light to go through). Example patents within the packaging category include:
| Publication Number | Title |
|---|---|
| US Patent 10,574,025 | Hermetic capsule and method for a monolithic photonic integrated circuit |
| US Patent 10,162,111 | Multi-fiber/port hermetic capsule sealed by metallization and method |
We cannot assure you that we will meet the conditions of the 2023 Purchase Agreement with Lincoln Park in order to obligate Lincoln Park to purchase our shares of common stock, and we cannot assure you that we will be able to sell any shares under or fully utilize the Roth Sales Agreement. In the event we fail to do so, and other adequate funds are not available to satisfy long-term capital requirements, or if planned revenues are not generated, we may be required to substantially limit our operations. This limitation of operations may include reductions in capital expenditures and reductions in staff and discretionary costs.
| Volume: | 904,143 |
| Day Range: | 0.84095 - 0.8999 |
| Last Trade Time: | 7:15:46 PM EDT |
AI
