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currently (besides ABB) I've only 2 shares - valneva and lwlg - they _have to_ come to to a new peak. as a d. lynch fan, twin peaks would be cool ,)
Crazy? The shorters are making money, you aren't.
Cope
what is key in the r/nvidia announcement this week, lies in the fact, that for the very first time, a leading worldwide conglomerate, along with other partners ($TSMC, $INTC... ) is recognizing the value of photonics in reducing the power use that is constraining the amount of work new #AIFactories can accomplish!
Now, a corollary of this statement, implies that photonics be compatible with CMOS foundries, to meet the volume targets demanded by the industry. The bottlenecks today are not in designing and prototyping (you will see many announcements at OFC25 for #200G/L, even #400G/L ) but in packaging and testing those components at scale (this was the call from Nvidia's Seyedi at Optica PECC conference last November).
Of course, existing base materials, are going to fight like hell to delay when they are kicked out of designs, but the true cost of ownership of the solutions they are introducing is torpedoed by the reliance on various amounts of DSP (Digital Signal Processing: extra power hungry components on the transceivers chips), by the reliance on multiplying the number of lanes (8-lanes, 16-lanes...), which are also incompatible with the power restrictions mentioned above.
The value of $LWLG Perkinamine TM, lies in its core molecular make up:
- It modulates light really fast (holds a world record along with Polariton Plasmonics, into the TeraHerz)
- It saves power to do so: claims up to 90% power saving vs competing solutions
- It is fully compatible with the CMOS chip manufacturing environment: see the PDK portfolio that was achieved in collaboration with the Singapore based Photonic foundry AMF (PR in May'24).
- It is so compact, it saves a lot of real estate on the chip, making room for the designers to pack in more features, if they so desire...
As a start-up, Lightwave Logic had to recently adjust its go-to-market strategy to reach a wider audience, but don't you think Nvidia, along with all the other players in the AI race who recently announced they are launching their proprietary solutions (AMD, Apple, Google, Amazon... along with their various suppliers: Broadcom, Cisco, Marvell, Lumentum, Coherent...) are going to rapidly make use of any solution that gives them an edge? The recent strategy adjustment has a huge benefit: it places the development costs on the competitors in this cutthroat environment.
That's why Yves was brought in, in this commercial race: to make sure that starting in 2025 and 2026, Lightwave Logic gets its fair share of the up to $2.5B serviceable market in which modulators could claim up to 25% of the value at higher speeds!!
Looking forward to what the coming months are going to unveil...
GLTAL
AR.
https://www.reddit.com/r/LWLG/comments/1jfz0yg/jensen_huang_nvidia_silicon_photonics/
Report all you want lol. Everyone is allowed to short LWLG.
Vaporware
Polariton 1THz modulators can scale!!! listen to the interview, only minor engineering left to be done!!! the science is PROVEN!!! with LWLG INSIDE!!!! Listen starting at 8 minutes Polariton will be the FIRST to have production volumes at 400Gbs lanes, and can extend to speeds in excess of 1Tbs lanes!!! with LWLG INSIDE!!!!
https://picmagazine.net/video/610/Record-breaking_bandwidth_of_1.1_THz_for_plasmonic_modulators
Nokia and @googlecloud are teaming up to revolutionize energy efficiency in telecom networks.
Nokia and @googlecloud are teaming up to revolutionize energy efficiency in telecom networks.
— Nokia (@nokia) March 20, 2025
Watch the interview from #MWC25 to learn how this partnership helps reduce energy consumption, optimize network performance, and accelerate the journey toward Autonomous Networks:… pic.twitter.com/spHZHtYUha
When Lightwave Logic uses the term "controlled availability" in their news release regarding their Process Design Kit (PDK), it signifies a strategic approach to the distribution of their technology. Here's a breakdown of what that generally implies:
Selective Distribution:
"Controlled availability" suggests that the PDK isn't being released for unrestricted, open access. Instead, it's being provided to a select group of partners, customers, or foundries.
Strategic Partnerships:
This approach often indicates that the company is focusing on establishing key strategic partnerships to ensure the successful implementation and adoption of their technology.
Phased Rollout:
It can also imply a phased rollout, where the technology is initially provided to a limited number of entities for testing, validation, and feedback before wider release.
Quality Control:
By maintaining control over the availability, Lightwave Logic can better manage quality control and ensure that the technology is being used correctly.
Protecting Intellectual Property:
It can also be a way to protect their intellectual property while still allowing for collaboration.
Focused Development:
By limiting distribution, the company can focus their development efforts and support on a smaller, more manageable group.
In the context of Lightwave Logic's news, "controlled availability" likely means they are working closely with specific semiconductor foundries and partners to integrate their electro-optic polymers into silicon photonics. This allows them to:
Ensure the technology is properly implemented.
Gather valuable feedback.
Refine their processes before broader commercialization.
Essentially, it's a measured and strategic approach to bringing their technology to market.
so..."controlled availability" what this means is that LWLG is part of the implementation process, the Customer signs on as Design Win for LWLG and LWLG's team is there to assist the PDK implementation for you ie controlled availability
Back End Of Line (BEOL) process encompasses key steps including EO polymer application, patterning and etching, Atomic Layer Deposition (ALD) encapsulation, EO polymer poling, contact pad opening, chip dicing, and end face creation and polishing. Crucially, the BEOL process is designed for compatibility with existing semiconductor fabrication lines, facilitating seamless integration with silicon photonic device manufacturing flows. This process offers flexibility, applicable at both wafer and chip levels up to the dicing stage.
https://s3.amazonaws.com/b2icontent.irpass.cc/2586/rl144468.pdf
Lightwave Logic Announces Controlled Availability of Silicon Photonics Process Design Kit for Advanced Electro-Optic Polymer Integration
Management team to attend the Optical Fiber Conference in San Francisco
DENVER, COLORADO / ACCESS Newswire / March 28, 2025 / Lightwave Logic, Inc. (NASDAQ:LWLG) (the "Company"), a technology platform company leveraging its proprietary electro-optic (EO) polymers to transmit data at higher speeds with less power, today announced the controlled availability of its cutting-edge Process Design Kit (PDK). This PDK enables the integration of the Company's advanced EO polymers into Silicon Photonic Integrated Circuits (Si-PICs) using Lightwave Logic's novel Back-End-of-Line (BEOL) process.
Despite the significant advancements in silicon photonics, scaling up to data rates of 200Gbps and 400Gbps presents inherent challenges. Traditional silicon photonics-based modulators face bandwidth limitations due to their reliance on charge-carrier effects, leading to increased power consumption and signal degradation at higher speeds. As data center and AI-driven networking demands continue to push for greater bandwidth efficiency, alternative materials such as EO polymers are poised to play a disruptive role in overcoming these bottlenecks. Polymers offer ultra-fast response times, low power consumption, and high electro-optic coefficients, making them a compelling solution to enhance the performance of silicon photonics beyond its conventional limits.
Consistent with its mission to augment silicon photonics performance to meet the stringent bandwidth and power consumption needs of artificial intelligence and networking applications across multiple generations, Lightwave Logic's groundbreaking BEOL process encompasses key steps including EO polymer application, patterning and etching, Atomic Layer Deposition (ALD) encapsulation, EO polymer poling, contact pad opening, chip dicing, and end face creation and polishing. Crucially, the BEOL process is designed for compatibility with existing semiconductor fabrication lines, facilitating seamless integration with silicon photonic device manufacturing flows. This process offers flexibility, applicable at both wafer and chip levels up to the dicing stage.
This advancement marks a significant step forward in the development of high-performance devices capable of 3.2 Tbps and beyond while preserving silicon photonics' unique cost and scalability advantages compared to alternatives such as thin-film lithium niobate or indium phosphide, which is crucial to the future of the industry.
"Our cutting-edge PDK represents a pivotal development in integrating our advanced EO polymers with silicon photonics," said Yves LeMaitre, Chief Executive Officer of Lightwave Logic. "By offering a BEOL process compatible with existing semiconductor fabrication lines, we enable our partners to seamlessly enhance their silicon photonic devices, meeting the ever-increasing demands for higher bandwidth and lower power consumption in AI and networking applications."
This PDK has already been implemented as part of collaborative efforts with two semiconductor foundries. These demonstrations highlight the PDK's potential to accelerate the commercialization of EO polymer-enabled silicon photonic devices, reinforcing Lightwave Logic's leadership in next-generation optical technologies.
In addition, Lightwave Logic will attend the 2025 Optical Fiber Conference, the premier global event for optical networking and communications, from March 30 through April 3, at the Moscone Center in San Francisco, CA.
Management has arranged a private meeting room on the showroom floor. Parties interested in scheduling a meeting may contact Atikem Haile, Lightwave Logic's VP of Marketing and Business Development, at atikem.haile@lightwavelogic.com.
For more information about Lightwave Logic and its technologies, please visit the company's website at www.lightwavelogic.com.
About Lightwave Logic, Inc.
Lightwave Logic, Inc. (NASDAQ:LWLG) www.lightwavelogic.com is a technology platform company leveraging its proprietary engineered electro-optic (EO) polymers to transmit data at higher speeds with less power in a small form factor. The Company's high activity and high stability organic polymers allow it to create next-generation photonic EO devices that convert data from electrical signals into light/optical signals for applications in telecommunications, and for data transmission potentially used to support generative AI.
Safe Harbor Statement
The information posted in this release may contain forward-looking statements within the meaning of the Private Securities Litigation Reform Act of 1995. You can identify these statements by use of the words "may," "will," "should," "plans," "explores," "expects," "anticipates," "continue," "estimate," "project," "intend," and similar expressions. Forward-looking statements involve risks and uncertainties that could cause actual results to differ materially from those projected or anticipated. These risks and uncertainties include, but are not limited to, lack of available funding; general economic and business conditions; competition from third parties; intellectual property rights of third parties; regulatory constraints; changes in technology and methods of marketing; delays in completing various engineering and manufacturing programs; changes in customer order patterns; changes in product mix; success in technological advances and delivering technological innovations; shortages in components; production delays due to performance quality issues with outsourced components; those events and factors described by us in Item 1.A "Risk Factors" in our most recent Form 10-K and 10-Q; other risks to which our company is subject; other factors beyond the company's control.
Contacts:
Ryan Coleman or Nick Teves
Alpha IR Group for Lightwave Logic
lwlg@alpha-ir.com
312-445-2870
SOURCE: Lightwave Logic
https://s3.amazonaws.com/b2icontent.irpass.cc/2586/rl144468.pdf
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The need for Lightwave Logic’s proprietary electro-optic polymers is more evident than at any prior point in history, with internet infrastructure coming under increasing strain due to increased online activity. For example, during the recent COVID-19 pandemic, leading platforms such as YouTube prevented high-definition (HD) streaming in Europe due to data throughput issues in existing internet infrastructure.
The Company’s current focus is on the datacom and telecommunications hardware supply chain for the 100 Gbps and 400 Gbps fiber optics communications market, seeking to integrate its proprietary materials into the devices that comprise key components in today’s internet infrastructure. Lightwave Logic’s unique value proposition, including ease of manufacture relative to traditional solutions, has driven several tier-1 and tier-2 potential strategic partners in the data and telecommunications markets to enter into non-disclosure agreements (NDAs) with Lightwave Logic to evaluate its technology for use in their devices, validating the demand for the Company’s solution in the marketplace. The Company expects to introduce its technology into the commercial marketplace in the near future.
Lightwave Logic is a wholly U.S.-based company with in-house materials synthesis, device/package design, wafer fabrication and testing capabilities at its Englewood, Colorado headquarters.
Having the modulator and integrated circuit development in-house has informed the materials development direction and vice versa. This vertically integrated business model enables a superior platform by aligning the design for manufacturability from materials to complex circuits with the following benefits:
Materials are called electro-optic when they enable interactions between applied electric fields and light passing through them. Notably, they change the refractive index seen by the light with minimum loss. The result is an instantaneous and accurate conversion of an electrical signal to an optical signal. Optical signals are better for transmission over distance: an increasingly useful feature as digital signal speeds are now reaching the GHz and THz ranges and the corresponding electrical transmission distances are shrinking to meters and centimeters.
EO polymers are intrinsically superior in speed and sensitivity to electric field to traditional electro-optic materials such as Lithium Niobate, Indium Phosphide and Silicon. They are engineered materials, made by embedding a variety of specially designed electro-optic chromophore molecules into a wide range of standard host polymers.
Chromophores are complex, large molecules, on a scale akin to drug molecules. They are hyperpolarizable, meaning their electron clouds are easily pulled into a different shape by the applied electric field, changing their optical properties such as index of refraction.
The material is poled to become electro-optic by applying a strong electric field along with heat. The hot material is relatively soft, allowing the chromophore molecules suspended in the host polymer to align in the same direction (poling). Cooling the poled material after the molecules are in place traps them in their active state even after the poling field is removed.
Although the electrons in the material respond to any applied electric field, they remain tightly bound to the molecule. The response to an applied signal is almost instantaneous response and recovery– like that of a tight spring– unlike materials that involve much slower macroscopic movement of free electrons.
Another key difference from traditional crystalline materials is the performance of EO polymers continues to improve as chemists explore the almost unlimited design space. Combinations of chromophores and host polymers can be tailored for specific applications.
In addition to innovating the EO polymer materials, Lightwave Logic takes its technology platform to the next level by developing ancillary materials and processes. These elements are brought together and demonstrated in advanced high-speed optical modulators.
The polymer is spun onto silicon wafers and standard microfabrication techniques are used to deposit and pattern metal electrodes and optical waveguides.
One well-known optical modulator device is the Mach-Zehnder interferometer. The light output is changed by changing the relative phase between the two arms. One common trick to double the effect for the same available drive voltage is to drive the two arms in opposite directions (push-pull mode). Polymers have an interesting advantage over most other electro-optic materials which are crystalline. The direction of polymer’s electro-optic activity is entirely determined by the direction of the applied poling field. By poling the two arms of the Mach-Zehnder in opposite directions, the resulting device automatically has push-pull operation with a single applied signal.
Once the modulator chip is made, it is packaged for mechanical protection and also to ensure signal quality for electrical and optical connections.
Below is a polymer optical modulator with >60 GHz bandwidth packaged with high-speed electrical connectors and optical pigtails.
Inspired by the remarkable record of integrated microelectronics, the opto-electronics industry has great interest in developing photonic integrated circuits (PICS). Photonics refers to devices that manipulate photons—that is, light—rather than electrons.
Even the best individual devices can be made more functional by integrating many together. Integration has many benefits, the most notable being dramatic improvements in size and cost. Yet, photonic integration has only recently come into the spotlight. The primary applications for photonics used to require stand-alone, high performance components such as used for long-haul telecom.
Now, photonic integration has suddenly come into the spotlight as electronic interconnects struggle to keep up with speed increases of electronic chips. Photonics is being looked at to replace electronics in already highly integrated applications such as chip interconnect. Co-packaging of electronics integrated circuits (ICs) with photonic interconnect, considered unlikely a few years ago, is now viewed by many as inevitable. However, this requirement poses new challenges that are acknowledged as difficult and that new technologies will be required to meet them.
P2IC™ (Polymer Photonic Integrated Circuits) are ideally positioned to be one of these new technologies. Lightwave Logic’s devices are made using conventional wafer-scale processing such as used for microelectronics and therefore similarly capable of being integrated. In addition, the polymer microfabrication processes are compatible with other materials platforms such as Silicon Photonics and Indium Phosphide which are now starting to become more integrated. In particular, the Silicon Photonics ecosystem has recently accepted that its roadmap will include adding more and more materials, each for their specific benefits. EO polymers’ speed and voltage advantages are attractive additions to this ecosystem.
A fiber link sends data from a transmitter to a receiver through an optical fiber cable. Lightwave Logic’s technology can be used to make a data modulator, a central function of the transmitter.
Datacenters and high-performance computing (HPC) are two market segments that demand the very highest speed optical fiber communications. The datacenter fiber communications segment includes applications ranging from connections inside hyperscale datacenters to fiber links between datacenter campuses.
Optical fiber communication is the infrastructure that supports internet content through its entire lifecycle, between businesses, consumers and datacenters. Behind the scenes, massive amounts of data move between computer processors inside datacenters (or inside supercomputers) as content is generated. In addition to these intra-datacenter links, there are also significant datacenter interconnection links between big datacenters to provide flexible capacity and resilience – all of these represent significant addressable market segments for Lightwave Logic’s technology.
Modulator performance limits the speed of the transmitter, which in turn limits the data-carrying capacity of the entire fiber link. EO polymers have superior speed and sharply reduce the electrical power needed to operate the modulators.
Lightwave Logic estimates that in 2019, the total market for opto-electronic components used in the fiber optics market reached a value of ~$26 billion and is forecasted to grow to approximately $80 billion by 2030.
Above: Market forecasts for photonic (electro-optic) components and transceivers used in optical fiber communications. (Source: Oculi LLC)
The growth in the optical fiber communications market is driven by many factors, primarily:
The historic trend has been a migration from text to graphics, followed by still graphics to increasingly high-definition video. On the accessibility front, the introduction of 5G will enable low-cost mobile internet connections at the same, or higher speeds, as today’s home broadband. This trend continues today as users demand more data at all times.
Recently, particularly since the onset of the COVID-19 pandemic, there has been a sharp increase in reliance on video-conferencing services, often replacing in-person meetings. As video conferencing becomes more commonly used, users will continue to demand faster response times to enable no-lag, real-time communications in full HD.
The benefits of EO polymers, such as low power usage, high speed, increased throughput and lower cost make them ideally suited for markets outside of communications as well, including in consumer, media, augmented reality/virtual reality, medical and industrial applications.
Developing, protecting and commercializing intellectual property is central to Lightwave Logic’s identity as a technology company. Lightwave Logic has over 50 U.S. and international patents and applications that are issued or pending.
These patents provide freedom of manufacture for the company’s electro-optic (EO) polymer materials systems and its optical device technology.
Lightwave Logic’s patent portfolio covers the following areas:
The company continuously seeks to innovate new electro-optic chromophores, designing molecular architectures to meet application needs such as high electro-optic activity and stability. We also design ancillary materials that are useful in conjunction with the EO polymers themselves. Example patents within the materials category include:
| Publication Number | Title |
|---|---|
| US Patent 7,902,322 | Nonlinear optical chromophores with stabilizing substituent and electro-optic devices |
| US Patent 9,535,215 | Fluorinated Sol-Gel Low Refractive Index Hybrid Optical Cladding and Electro-Optic Devices Made Therefrom |
As the company demonstrates its materials in devices, such as modulators, it has engineered ways to enhance device performance by means of device design and optimized control. Example patents within the optical device category include:
| Publication Number | Title |
|---|---|
| US Patent 10,520,673 | Protection layers for polymer modulators/waveguides |
| US Patent 7,738,745 | Method of Biasing and Operating Electr-Optic Polymer Optical Modulators |
Materials innovations are followed by methods in which the Company or its partners can best work with the materials in the fabrication process. Example patents within the fabrication category include:
| Publication Number | Title |
|---|---|
| US Patent Application 20190353843 | Fabrication process of polymer based photonic apparatus and the apparatus |
| US Patent 10,591,755 | Direct-drive polymer modulator methods of fabricating and materials therefor |
Polymers can be used to add functionality to existing semiconductor devices, inclusive of making photonic integrated circuits (ICs). Areas of active innovation include how to get light from one material system into another with minimal losses. Example patents within the semiconductor integration category include:
| Publication Number | Title |
|---|---|
| US Patent 10,527,786 | Polymer modulator and laser integrated on a common platform and method |
| US Patent 10,511,146 | Guide transition device with digital grating deflectors and method |
Challenges for high-speed optical packaging includes maintaining the quality of radio-frequency electrical signals and hermetic/environmental sealing of devices for durability (while still allowing light to go through). Example patents within the packaging category include:
| Publication Number | Title |
|---|---|
| US Patent 10,574,025 | Hermetic capsule and method for a monolithic photonic integrated circuit |
| US Patent 10,162,111 | Multi-fiber/port hermetic capsule sealed by metallization and method |
We cannot assure you that we will meet the conditions of the 2023 Purchase Agreement with Lincoln Park in order to obligate Lincoln Park to purchase our shares of common stock, and we cannot assure you that we will be able to sell any shares under or fully utilize the Roth Sales Agreement. In the event we fail to do so, and other adequate funds are not available to satisfy long-term capital requirements, or if planned revenues are not generated, we may be required to substantially limit our operations. This limitation of operations may include reductions in capital expenditures and reductions in staff and discretionary costs.
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