Replies to post #1541 on Intel Corp (INTC)

[Yousef]

Spokeshave,

Re: "I see no evidence, other than your pronouncements, that AMD intends to use
UMC for 0.09u at all."

Well you haven't been looking very hard have you ... Only a "process genius"
like yourself would believe that AMD will access UMC for 130nm and then jump
to 65nm with UMC. But here is a statement from a couple of "horse's patoots" that
you might recognize -->

AMD's 300mm fab with UMC pivotal in race with Intel

"The new joint venture, called AU Pte. Ltd., will begin production in 2005.
By getting more processor die on a wafer, AMD will be able to maintain competitive
pricing, according to Sanders. The AMD chairman wouldn't say how many more, but
industry consensus is that a 300mm wafer can hold twice as many die as a 200mm wafer.

"I leave it to your imagination as to how many more processors we can produce in the
new fab," Sanders said. "However, when we reach full production, we will have
10,000 [300mm] wafer starts a week using 65-nanometer-node technology."

The deal also affords AMD hands-on 300mm-wafer experience by letting the company
use one of UMC's 300mm fabs as a pilot line, according to AMD president Hector Ruiz.
Additionally, the companies will jointly develop 0.09-micron process technology. "

Make It So,
Yousef