Thursday, October 10, 2002 12:26:05 PM
Spokeshave,
Re: "I see no evidence, other than your pronouncements, that AMD intends to use
UMC for 0.09u at all."
Well you haven't been looking very hard have you ... Only a "process genius"
like yourself would believe that AMD will access UMC for 130nm and then jump
to 65nm with UMC. But here is a statement from a couple of "horse's patoots" that
you might recognize -->
AMD's 300mm fab with UMC pivotal in race with Intel
"The new joint venture, called AU Pte. Ltd., will begin production in 2005.
By getting more processor die on a wafer, AMD will be able to maintain competitive
pricing, according to Sanders. The AMD chairman wouldn't say how many more, but
industry consensus is that a 300mm wafer can hold twice as many die as a 200mm wafer.
"I leave it to your imagination as to how many more processors we can produce in the
new fab," Sanders said. "However, when we reach full production, we will have
10,000 [300mm] wafer starts a week using 65-nanometer-node technology."
The deal also affords AMD hands-on 300mm-wafer experience by letting the company
use one of UMC's 300mm fabs as a pilot line, according to AMD president Hector Ruiz.
Additionally, the companies will jointly develop 0.09-micron process technology. "
Make It So,
Yousef
Re: "I see no evidence, other than your pronouncements, that AMD intends to use
UMC for 0.09u at all."
Well you haven't been looking very hard have you ... Only a "process genius"
like yourself would believe that AMD will access UMC for 130nm and then jump
to 65nm with UMC. But here is a statement from a couple of "horse's patoots" that
you might recognize -->
AMD's 300mm fab with UMC pivotal in race with Intel
"The new joint venture, called AU Pte. Ltd., will begin production in 2005.
By getting more processor die on a wafer, AMD will be able to maintain competitive
pricing, according to Sanders. The AMD chairman wouldn't say how many more, but
industry consensus is that a 300mm wafer can hold twice as many die as a 200mm wafer.
"I leave it to your imagination as to how many more processors we can produce in the
new fab," Sanders said. "However, when we reach full production, we will have
10,000 [300mm] wafer starts a week using 65-nanometer-node technology."
The deal also affords AMD hands-on 300mm-wafer experience by letting the company
use one of UMC's 300mm fabs as a pilot line, according to AMD president Hector Ruiz.
Additionally, the companies will jointly develop 0.09-micron process technology. "
Make It So,
Yousef
Recent INTC News
- Intel shares rise after joining Terafab semiconductor initiative • IH Market News • 04/07/2026 01:50:28 PM
- Form 8-K - Current report • Edgar (US Regulatory) • 04/03/2026 04:50:37 PM
- Intel Appoints Aparna Bawa as Executive Vice President and Chief Legal & People Officer • Business Wire • 04/02/2026 08:05:00 PM
- Ceasefire Hopes and Strong Economic Data Power Wall Street Rally to Start Q2 • IH Market News • 04/01/2026 08:34:46 PM
- Intel to repurchase Apollo’s stake in Irish chip facility for $14.2 billion • IH Market News • 04/01/2026 02:48:34 PM
- Intel to Repurchase 49% Equity Interest in Ireland Fab Joint Venture • Business Wire • 04/01/2026 01:00:00 PM
- Intel to Report First-Quarter 2026 Financial Results • Business Wire • 03/31/2026 09:02:00 PM
- Form SCHEDULE 13G/A - Statement of Beneficial Ownership by Certain Investors: [Amend] • Edgar (US Regulatory) • 03/27/2026 01:51:11 PM
- Intel shares rise after report of planned CPU price increases • IH Market News • 03/25/2026 03:24:25 PM
- Form DEFA14A - Additional definitive proxy soliciting materials and Rule 14(a)(12) material • Edgar (US Regulatory) • 03/23/2026 08:38:44 PM
- Form DEF 14A - Other definitive proxy statements • Edgar (US Regulatory) • 03/23/2026 08:35:22 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 03/04/2026 12:57:09 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 03/04/2026 12:56:24 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 03/04/2026 12:55:26 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 03/04/2026 12:54:23 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 03/04/2026 12:53:24 AM
- Intel Board Chair Frank D. Yeary to Retire Following Annual Meeting; Dr. Craig H. Barratt Elected as Chair • Business Wire • 03/03/2026 09:01:00 PM
- Intel Corporation to Participate in Upcoming Investor Conference • Business Wire • 02/18/2026 09:30:00 PM
- Nvidia, Meta Advance on Broader AI Infrastructure Alliance; AMD Slips • IH Market News • 02/18/2026 11:26:05 AM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 02/03/2026 09:56:48 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 02/03/2026 09:55:28 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 02/03/2026 09:54:11 PM
- Form 4 - Statement of changes in beneficial ownership of securities • Edgar (US Regulatory) • 02/03/2026 09:53:03 PM
