Replies to post #265674 on InterDigital Inc (IDCC)

[JimLur]

Revlis, You have got the best memory of anyone I ever met. I can't believe you remembered that and to top it off you were able to find the post.

I wonder if this could be revenue bearing for IDCC ?

Although the article says this component was designed for IDCC I question whether we can make any money from it.

Do you think it may have been a part of the Slimchip?

[lastchoice]

IC technologies mix-and-match capability - Different technologies can be mixed: SiGe or GaAs for the RF part along with CMOS for the baseband part.
Different wireless technologies: WLAN, Bluetooth, GPS, WiMAX, GSM CDMA, 3G, HSPDA coming from various chip providers can be integrated in a sip to offer the customer the best combination of wireless technologies in the industry.
Then SiP is the answer

[lastchoice]

idcc used to sell a SIP. their modem included an IFX chip for 2g. both chips on the same substrate. hopefully, it's nothing to do with slimchip, but idcc could have been an insight customer for that.

alternatively, that's when they met insight, and started formulating the future. idcc has an 3g protocol stack, MIH solution for switching between radio network technologies, Kineto relationship for FMC, (fixed-mobile-convergence (wifi)). a multi-radio front-end SIP would be a great place to integrate.

idcc has RF expertise, Insight the manufacturing expertise, (no small task in very advanced areas), and idcc brings the layers 1 and 2 radio networking.

a manufacturer can lower size, complexity, risk, logistics, development expenses, while at the same time improving the chance of success, and time-to-market.

the final product is smaller, and can connect to anyting it sniffs, "WLAN, Bluetooth, GPS, WiMAX, GSM CDMA, 3G, HSPDA ."