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Re: revlis post# 265674

Monday, 08/10/2009 8:52:05 AM

Monday, August 10, 2009 8:52:05 AM

Post# of 436086
IC technologies mix-and-match capability - Different technologies can be mixed: SiGe or GaAs for the RF part along with CMOS for the baseband part.
Different wireless technologies: WLAN, Bluetooth, GPS, WiMAX, GSM CDMA, 3G, HSPDA coming from various chip providers can be integrated in a sip to offer the customer the best combination of wireless technologies in the industry.
Then SiP is the answer

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