News Focus
News Focus
icon url

olddog967

07/12/08 8:00 PM

#226598 RE: gio #226597

gio: Here is the actual quote according to the site where Yogasingam works. Still not sure what he is referring to.

Moving up the signal chain, Infineon won big. It supplies the UMTS transceiver, suspected to be the PMB 6952, as well as the baseband processor, which is actually a two-chip module in a single package. The first chip is the X-Gold 208 (PMB8877), which caters to GSM/GPRS/EDGE waveforms. The second chip is marked the PMB8802 and is suspected to be the WCDMA/HSDPA accelerator for 3G. While there's still some debate as to whether this combo package with Apple markings may in fact be Infineon's XGold 608 (PMB8878), which Quirk and Yogasingam expected to see, that chip has as yet not become available to verify under Semiconductor Insights' microscope.

In any case, that it's broken into two chips is surprising," said Carey, given that both Nokia and Qualcomm have integrated both functions it into a monolithic die. However, there may be more to the decision than design choice. "We suspect the second die has something to do with one of the Interdigital patents," said Yogasingam.

http://www.techonline.com/showArticle.jhtml?pgno=1&articleID=209000013

The following site has a video on the actual teardown. IDCC is discussed at around 5:30 of part 1, and the beginning of part 2.

http://www.eetimes.com/news/latest/showArticle.jhtml;jsessionid=IE4DKPJUXWARIQSNDLSCKHA?articleID=209000009



icon url

Catchnrel

07/12/08 9:54 PM

#226615 RE: gio #226597

Is anyone willing to speculate whether IDCC may be inside that Infineon power management chip, whether its usage alone may be worth watching in other handsets, and what implications there might be? Maybe I'm reaching, but I thought it was worth asking. TIA