Saturday, July 12, 2008 8:00:17 PM
gio: Here is the actual quote according to the site where Yogasingam works. Still not sure what he is referring to.
Moving up the signal chain, Infineon won big. It supplies the UMTS transceiver, suspected to be the PMB 6952, as well as the baseband processor, which is actually a two-chip module in a single package. The first chip is the X-Gold 208 (PMB8877), which caters to GSM/GPRS/EDGE waveforms. The second chip is marked the PMB8802 and is suspected to be the WCDMA/HSDPA accelerator for 3G. While there's still some debate as to whether this combo package with Apple markings may in fact be Infineon's XGold 608 (PMB8878), which Quirk and Yogasingam expected to see, that chip has as yet not become available to verify under Semiconductor Insights' microscope.
In any case, that it's broken into two chips is surprising," said Carey, given that both Nokia and Qualcomm have integrated both functions it into a monolithic die. However, there may be more to the decision than design choice. "We suspect the second die has something to do with one of the Interdigital patents," said Yogasingam.
http://www.techonline.com/showArticle.jhtml?pgno=1&articleID=209000013
The following site has a video on the actual teardown. IDCC is discussed at around 5:30 of part 1, and the beginning of part 2.
http://www.eetimes.com/news/latest/showArticle.jhtml;jsessionid=IE4DKPJUXWARIQSNDLSCKHA?articleID=209000009
Moving up the signal chain, Infineon won big. It supplies the UMTS transceiver, suspected to be the PMB 6952, as well as the baseband processor, which is actually a two-chip module in a single package. The first chip is the X-Gold 208 (PMB8877), which caters to GSM/GPRS/EDGE waveforms. The second chip is marked the PMB8802 and is suspected to be the WCDMA/HSDPA accelerator for 3G. While there's still some debate as to whether this combo package with Apple markings may in fact be Infineon's XGold 608 (PMB8878), which Quirk and Yogasingam expected to see, that chip has as yet not become available to verify under Semiconductor Insights' microscope.
In any case, that it's broken into two chips is surprising," said Carey, given that both Nokia and Qualcomm have integrated both functions it into a monolithic die. However, there may be more to the decision than design choice. "We suspect the second die has something to do with one of the Interdigital patents," said Yogasingam.
http://www.techonline.com/showArticle.jhtml?pgno=1&articleID=209000013
The following site has a video on the actual teardown. IDCC is discussed at around 5:30 of part 1, and the beginning of part 2.
http://www.eetimes.com/news/latest/showArticle.jhtml;jsessionid=IE4DKPJUXWARIQSNDLSCKHA?articleID=209000009
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