He answered on a question from the organizer of the event. So the first stage 3 FG500 company is sending us there chips in Q2 2026 , We only need to coat the polymer and the encapsulation ( protection of polymer ) which will be done in denver by lwlg. For those "test chips" Than those chips can go to the FG500 partner for further application on end devices. For future bigger orders it will be the foundries who will be doing the coating and encapsulation for us. also i believe yves said that he expected our part of this to be done by end of june ( end q2) which means : Q3 is first testing of bigger order produced chips. he then said : "those companies do not play around , when they order after this it is with the hundred thousands of chips for further testing."
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