Replies to post #211237 on Lightwave Logic Inc (LWLG)

[KCCO7913]

Yes but LWLG needs to develop a material that can withstand the higher temperatures of CPO first. By the time that happens, TSMC will probably get their SiPh MRR's nailed down and cheap even with their temperature controllers.

Lots of work on MRRs to be published at OFC. Below is a link from the conference search function to all the papers on MRR's.

Chyna has a few publications. 290G in a ring. A 6.4T transmit chip using rings at 200G/lane. Crazy.

https://www.ofcconference.org/en-us/home/schedule/schedule_search/?searchtext=ring&searchmode=allwords&speakerfilter=&eventtrack=0&presentationtype=