wow nrdc I'm amazed you finally said something I can agree with here, The NDA should be ironclad
EXACTLY!!! as should ALL of the now approximately 40 of these NDA Agreements (Deals!!!) that LWLG/Lebby has struck over the past handful of years, and many of these are with Tier 1's, makers of Transceivers, Foundries, Contract Manufacturers, etc,
Keep in mind that Lebby is working Tier 1 Commercial Agreements now on 3 Continents!!! Let's not forget these are highly complicated multi-year deals likely with upfronts and minimum volumes etc, and some of these Commercial Agreements may also be Multi-Level Cross Functional Commercial Agreements that will come with "joint PR's" from all of the parties involved
Lebby set out SAM/SOM guidance at the 2023 ASM, in 2024 coincident with the ONE AND ONLY TIMELINE he has used since at least as far back as the 2019 ASM, the Customer Acceptance was set for 2024 with SAM/SAM guidance for 2024 of 7900 modulators which would have been indicative of SAMPLING, heck that number of modulators could come from ONE WAFER!!! Investors know there has been a CONSTANT STREAM OF WAFERS coming into LWLG labs in 2024, the estimate was about ONE EVERY TWO WEEKS, which would be indicative of MANY Foundries!!! If a Foundry can generate a Wafer for LWLG run every 6 months that would be 2 Wafers per year, so based on the number of Wafers being received the math would suggest about a DOZEN Foundries making Wafers for LWLG, to be conservative cut that in half and LWLG is still getting Wafers from at least a HALF DOZEN Foundries!!! The SAM/SOM guidance showed substantial ramp in volume in 2025 and MASS COMMERCIAL in 2026, this is all consistent even with what Andy B of Arista used on his slides showing Polymers in HVP (high volume production) in 2026!!!
Benzinga question on the commercialization status, Lebby said the following
Since we've produced some world class results earlier this year, and the Industry node, sounds technical, is 200gbs/second, this is where all the Internet Industry is looking at today, especially for designing to go into Data Centers, and we demonstrated some really state of the art performance, we've had a lot of interest from Tier 1 companies since then, I've given a few talks and a few updates, but what I can say today is that we have deepening relationships with these folks, and they are not just in the U.S., they are in Europe, as well as in Asia, and so this is interest level, these companies include some of the world's biggest Transceiver component manufacturers, and these folks are looking at our technology to implement into next-generation Transceivers, and so we've been engaging with them on a number of different fronts, and one of the issues that these folks are having is how do they upgrade their Transceiver components, and some of these components include something called Silicon Photonics... Silicon Photonics is a silicon chip that has Photonic components on it, some people call that a PIC (Photonic Integrated Circuit) other people call it Silicon Photonics, but basically, they've hit a wall in their performance, and they are looking at our materials, our Polymers, to upgrade their performance, and so we've been in deep discussions with this, and I'm working very very hard to put together Commercial Agreements on that, and this is something that I've indicated to our shareholders that is taking a little longer than it was expected, but it's also really exciting because now you can start thinking about the scale of our technology, so this is happening and I'm working really hard on it
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