The leading edge to my knowledge is Huawei bonding 6 inch TFLN wafers to 8 inch silicon wafers and they believe the same process can be applied to future 8 inch TFLN wafers.
Lightium claims to be using 200mm but they’re a brand new company with only a few people so who knows what is actually going on.
For some reason Huawei’s upcoming paper on the topic at CLEO has been withdrawn. So I wonder if it didn’t make it through the peer review process.
Market Data 
Markets 
AI
