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KCCO7913

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Re: prototype_101 post# 188702

Sunday, 04/28/2024 8:56:32 PM

Sunday, April 28, 2024 8:56:32 PM

Post# of 232318
Yes that is correct.

The leading edge to my knowledge is Huawei bonding 6 inch TFLN wafers to 8 inch silicon wafers and they believe the same process can be applied to future 8 inch TFLN wafers.

Lightium claims to be using 200mm but they’re a brand new company with only a few people so who knows what is actually going on.

For some reason Huawei’s upcoming paper on the topic at CLEO has been withdrawn. So I wonder if it didn’t make it through the peer review process.
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