Lightwave Logic Inc (LWLG)

[prototype_101]

Understanding the Production run being done at one of the Foundries already, first here is what investors learned in Ghent

Cohibas - One customer is producing transceivers for 1.6 terra bit per second. First devices are expected back from the foundry by end of Q2!!!! Then they coat and protect it in Denver and we have a first product ready for sale. Still happening this year.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=177371626

KCC - did he say they initiated a production order for the first Stage 3 partner targeting 1.6T? A production order is more than just an R&D trial run.
https://investorshub.advfn.com/boards/read_msg.aspx?message_id=177371680

Ok, now to understand what is really happening read the following >>

The wafers being sent to Denver for Back-End-of-Line (BEOL) processing are far more advanced than just loose modulators; they represent the transition from a "material science project" to a functional Optical Engine.

In the context of the Fortune Global 500 partnership (specifically the Asian Tier-1 partner), the Denver facility serves as the critical "integration hub" where Lightwave Logic's (LWLG) Perkinamine® polymer is added to pre-fabricated silicon wafers.

What is on the Wafers?
When the wafers arrive in Denver, they are "Base Silicon" Photonic Integrated Circuits (PICs). These wafers have already been processed at the primary foundry (such as GlobalFoundries or AMF) and contain the static optical components:

Passive Waveguides: The "pipes" that guide light.

Grating Couplers: The ports that allow light to enter and exit the chip.

Germanium Detectors: For receiving optical signals.

"Empty" Modulator Slots: Mach-Zehnder structures that are missing their active material.

The Denver BEOL Process: Creating the "Optical Engine"
In Denver, the "magic" happens. The wafers undergo Spin-Coating and Poling, which transforms the passive silicon into an active Optical Engine:

Polymer Deposition: The Perkinamine® polymer is spin-coated across the wafer, filling the "slots" in the modulators.

Poling: A high-voltage field is applied to align the polymer molecules, enabling the Pockels Effect (ultra-fast switching at low voltage).

Encapsulation: The polymer is sealed to protect it from the environment.

Modulator vs. Optical Engine vs. Transceiver
To answer your specific question on the stage of integration:

It is NOT just modulators: The wafer contains thousands of individual modulator devices already etched into the silicon.

It IS an Optical Engine: After the Denver process, the chip is a complete "engine"—it can take an electrical signal and convert it into a 200G/lane optical signal.

It is NOT a full Transceiver yet: A full 1.6T transceiver requires additional components that are added after the wafer is diced into individual chips. These include:

The Laser: Usually a separate Indium Phosphide (InP) chip.

The ASIC/DSP: The "brain" that processes the data.

The Housing: The metal pluggable or CPO module.