AMD has done a very confusing thing... With that table 9 in the thermal guidelines. I understand where the confusion comes from because my initial impression was similar to what OC is observing. It is written such that it looks like table 9 is describing the characteristics of the Opteron processor and can be used to find TDP as a function of case temperature.
As you point out, simple math shows the table actually describes the behavior of the thermal solution (heat sink and fan), not the opteron CPU itself. For most system design engineers the table is kind of a "no duh" sort of thing once you figure out what AMD is talking about with it. Table 9 is just as valid for an Intel Prescott CPU as it is for an Opteron CPU! I notice so far OC has not replied to my earlier note on this subject: http://www.investorshub.com/boards/read_msg.asp?message_id=8700578
Totally understand what you are saying and the relationship you have shown are quite clear - the thing is Tcase max is not something adjustable - it is a fixed value for every single cpu. What I am saying is that whilst the actual value can vary from cpu to cpu the fixed value is pre-programmed into the individual cpu at testing in Singapore. So you cant have an increase in the Tcasemax that you describe in your second paragraph as a consequence of increased power dissipation.
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