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alan81

06/14/11 11:17 AM

#102277 RE: Elmer Phud #102276

I suspect per die payments would lower cost now during start-up, but be made up for in higher costs later in the life cycle...
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wbmw

06/14/11 11:28 AM

#102279 RE: Elmer Phud #102276

AMD is now paying by the good die, no longer by the raw wafer. I would think this lowers their cost.


Global Foundries will still be charging more per die for larger die, and the negotiated price is still based on where GF estimated yield to be. AMD only makes off with lower costs if they anticipated lower yields than what GF anticipated (when the negotiated price was fixed), and they were right about the yields in fact being lower.
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chipguy

06/14/11 11:49 AM

#102282 RE: Elmer Phud #102276

AMD is now paying by the good die, no longer by the raw wafer. I would think this lowers their cost.

Does that apply to Llano too or only BD?

That would help but 32 nm hik/mg SOI is still a pretty expensive
process to build "cost reduction" combos of obsolete CPUs and
GPUs for OEMs.