Semi Capex (Note: these are not the SEMI numbers):
Fab tool book-to-bill hits 0.86 in October
By Mark LaPedus
Semiconductor Business News
(11/20/02 05:52 p.m. EST)
SAN JOSE--Reflecting the current IC downturn, the book-to-bill ratio for the worldwide semiconductor equipment industry hit 0.86 for the month of October, a slight decline from 0.89 in September, according to new figures from VLSI Research Inc. here today.
In November, the chip-equipment market is not expected to improve, as the worldwide equipment book-to-bill ratio is projected to fall to 0.85, according to the San Jose-based research firm.
“Conditions throughout the electronics food chain remain dismal, leading to further deterioration in equipment billings for the rest of the year,” according to VLSI Research.
Billings for October were the lowest level for the second half of 2002. Billings were $2.245 billion for October, down 30% from $3.233 billion from September, but up 15% from the like period a year ago, according to VLSI Research.
Bookings were $1.936 billion last month, down from $2.885 in September, according to the research firm.
Of the total billings in October, $1.34 billion were for wafer processing equipment, $440 million for test and related equipment, $120 million for assembly, and $340 million for service and spares.
In comparison, of the total billings in September, $1.72 billion were for wafer processing equipment, $650 million for test and related equipment, $200 million for assembly, and $340 million for service and spares.
It could go from bad to worse. In November, billings and booking are expected to hit $2.155 billion and $1.841 billion, respectively.
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