Replies to post #37916 on Zeev's Turnips Patch-No Politics (ZEEV)

[Zeev Hed]

ml, cmp is not used just with 300 mm, it used everywhere Chemical Mechanical Polishing (CMP) is used, that is essentially all the copper layers and many other layers as well, in some wafers, CMP is used more than 20 times in the process. The finer the features, the more essential it becomes, I think that nothing under .25 micron feature is polished by older technologies.

Zeev

[jdaasoc]

The exceptions are Samsung and INTC.

The #1 in volume and profits in DRAM and CPUs respectively. Add the Tawainese 300 NM fabs and you come to realize that represents majority of semiconductor products that is shipping is coming off smaller geometry and even possibly 300 NM fabs.

AMGN and EXPE are flying AH. I couls see AMGN going higher but when shi* like EXPE goes higher no reason to be short IMO.