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Post# of 704049
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Zeev Hed

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Zeev Hed

Re: mlsoft post# 37916

Wednesday, 10/23/2002 5:32:59 PM

Wednesday, October 23, 2002 5:32:59 PM

Post# of 704049
ml, cmp is not used just with 300 mm, it used everywhere Chemical Mechanical Polishing (CMP) is used, that is essentially all the copper layers and many other layers as well, in some wafers, CMP is used more than 20 times in the process. The finer the features, the more essential it becomes, I think that nothing under .25 micron feature is polished by older technologies.

Zeev

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