...but will it leak before or after DEC07 Options EX? JAN08? the next ER/CC?
Based on the past, I doubt we will get any info from AAPL, but there is a chance that RIMM might let the details/spcs slip.
As to MRVLs power saving technology, it looks like TXN has just released the same type of device/chip as MRVL (can you say patent litigation??).
Lakers, If you know the workings on these products, do you know the difference? Is this a competing product? From the PRs, it looks like the MRVL chip is for small/smaller power supply(s) while the TXN is geared toward the bigger devices?
You heard SS in the CC... There are a billion devices shipped per year that could use this technology!!! I don't know the ASP, but the potential here looks awesome.
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