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Lakers_w

11/30/07 12:55 PM

#14529 RE: DJinNJ #14512

You are correct. TI's single-chip, interleaved power factor correction (PFC) control circuit is for multi-kilowatt communications, server and industrial systems, not for consumer electronics unlike MRVL's chip.

These range from high-end communications systems to embedded white goods motor drives in refrigerators and air conditioners to HID lighting ballasts.

In line-operated systems with power levels from 75 W to 1kW and above, the UCC28070 helps reduce total harmonic distortion, allowing today's systems to better maximize usable outlet power and accommodate extreme variations and disturbances in various AC line voltage levels used around the world.

Remember, iPhone spec was leaked 8 mos before its launch. I expect the same thing will happen here. Ditto BB9K. Any mentioning of either phone using Tavor, or MRVL chip in general would boost the stock significantly.

AT&T CEO: Expect a 3G iPhone in 2008
http://eetimes.com/news/latest/showArticle.jhtml;jsessionid=DORZXVU5NT0QQQSNDLSCKHA?articleID=204301108

The news somewhat trumps any announcement scheduled by Jobs at the January Macworld conference in San Francisco. Jobs, who is famous for keeping big announcements secret, is expected to mention the iPhone's progress during his keynote. However, exact details of future iPhone designs have not been disclosed. Apple has not commented publicly on Stephenson's revelation.