Sorry, I hit "Submit" before I was finished. Here's the completed post:
Useless. What this tells me is that, until today, you had no idea what hurdles plasmonics needed to overcome.
From one source cited - ". Furthermore, silicon photonics platforms have successfully leveraged advancements in heterogenous integration of light sources using methods such as waferbonding, flip-chip bonding, and micro-transfer printing to integrate emerging photonic IC technologies based on materials like Graphene, Ferroelectrics, Plasmonics, and others." So, integration doesn't look like an issue. BTW, graphene can be used in plasmonic waveguides, as can gold, silver, aluminum and copper. Not exactly exotic materials.
This paper states "Because the Y-shaped structure is advantageous in that it is simple to fabricate, offers low loss transmission, and allows for easy integration into photonic circuits." Low loss, easy to integrate. Seems straightforward.
Polariton's new patent says "In particular, connection and/or coupling losses can be reduced, thereby enabling large bandwidth applications." This is in relation to the "protective layer" which can be applied via ALD (it sounds like it's LWLG's patented sealing technology).
Plus, Polariton is conducting Telcordia testing, as shown on their website and the recent LinkedIn post. Results so far are excellent, meaning stability issues have been addressed.
There is ample evidence that tangible progress has been made in bringing plasmonics to commercialization. I'll believe technical papers, patents and public documentation over AI.
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