TOTAL BS!!!! Only a complete knucklehead would have thought that after the 2021 ASM the Foundry PDK's would not take a MINIMUM of 2-3 years to complete!!! And the rest of the story is all about a DYNAMIC ENVIRONMENT and certain STRATEGY CHANGES that were made in 2024 and 2025, here is the TRUTH spelled out for knuckleheads like you!!
1) In December 2023 Lebby talked about closing deals in 2024, these were all Tier 2 deals as the 200gb on 200mm Wafers with World record metrics had not happened yet
2) in 1Q of 2024 there was a strategy shift to Tier 1's when at OFC in March 2024 Lebby unveiled the 200gb on 200mm Wafers with World record metrics, Lebby was even quoted as saying "what would you rather have 10 smaller deals or one giant deal"
3) from OFC in March of 2024 to yearend 2024 Lebby was "being dragged along by Tier 1's" on 3 continents, and he was attempting to build complex OE's including Lasers etc at the device specs of these various Tier 's on 3 continents, it was a Herculean task for LWLG's teeny tiny Devices team
4) also coincident to this happening the AI revolution was gaining steam and the data processing needs were growing exponentially, couple this with Yves talking with these Tier 1's who were also feeling like LWLG's Devices team was going to become a "leveraged" direct competitor to them, and so the Strategy Shift came in December 2024
5) Lebby's in-house Devices team was eliminated as the Tier 1 Devices teams would each do their own custom OE developments and compete against each other, this would accomplish both faster time to market, and no longer the fear of LWLG as a Devices competitor, Shorts want to spin this as firing LWLG's in-house Devices team for failure to create a 4x200 Modulator Array, even Yves stated bluntly that this just wasn't the case, Yves said it was basically child's play to slap 4 modulators together in an array PIC, but Lebby had leapfrogged to creating full blown OE's of various designs of various Tier 1's on 3 continents!!
6) teddybear tried to spin it that LWLG's incredible 200gb Slot modulator produced on 200mm Wafers was just thrown on the scrap heap!! TOTAL BS!!! LWLG is currently assisting the various Tier 1's with their custom OE builds as Yves even pointed out with "our modulators"
7) the traction with the tier 1's is so great they are NOT waiting to implement LWLG's Polymers at 400gbs lanes instead working to incorporate them into 200gbs lanes currently, here from Blum's interview,
Transceiver/AI Systems/Hyperscalers ARE Big Boys!!!! Big Boys are implementing at 200gb lanes and NOT waiting for 400gbs, that's how IN DEMAND with the giant companies that LWLG is TODAY!!!
Now let's talk adoption. Um what kind of customer attraction are you seeing now and where are you on the journey from evaluation to actual design wins?
Yeah. Yeah, we're seeing we're seeing verybroad traction from you know transceiver companies making transceivers like the 1.60 gig transceivers that I mentioned earlier, to AI companies who make entire AI systems, to the Hyperscalers.
We're in the design win cycle with several customers, right? what is interesting actually, what surprised me is that they don't wait for 400G. They're starting now with 200 G already because they see value in that, right? I mean we're uh um you know I mean it's it's interesting to see because seems like some of the existing legacy materials like just silicon photonics or Indium phosphide they're already you know struggling with 200g and uh so um so customers are designing products with the polymers based on that and um and obviously for 400g uh um there is a real use very large urgency to move to polymersright and it's not going to stop at 400g
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