Replies to post #223709 on Lightwave Logic Inc (LWLG)

[prototype_101]

It's been discussed here many times, the Foundry NDA relationships are very sensitive and until reaching Stage 4 of the Customer cycle, unless otherwise agreed upon by both parties, will remain strategically confidential

Global Foundries Anthony Yu talking about "new materials" contains the hard truth that Polymers will be the only real choice, start watching the clip around 10 minute market, the first words out of Yu's mouth when he talks of new materials is Optical Polymers!! then Yu goes on to say TFLN with the snarkiest possible look on his face!!! why? because TFLN can't scale in volume, and it has Foundry contamination issues, and it can only be sourced primarily from China, and even worse when he talks about BTO he actually jokes about having to hide that from the management, and that's because of high contamination risks to the Foundry!!!

LWLG Polymers can easily be Integrated in Silicon Photonics Foundries, the supply is virtually unlimited, and US based with LWLG!!!!

LWLG's "EASE OF INTEGRATION" means the following:

A key part of the value proposition that Yves LeMaitre and Robert Blum have emphasized. Their messaging around "ease of integration" means that transceiver makers, including those using NVIDIA's MRR technology, will not have to completely redesign their current Photonic Integrated Circuit (PIC) platforms.

The Additive and Foundry-Friendly Process
The core of this "ease of integration" is that Lightwave Logic's electro-optic (EO) polymers can be integrated using a standard Back-End-of-Line (BEOL) process. This process is essentially "additive," meaning the polymer layer is applied on top of an existing silicon PIC, such as one with Mach-Zehnder or Micro Ring Resonator (MRR) modulators.

Here's how this works:

Standard PIC Fabrication: The transceiver manufacturer, or their foundry partner (like TSMC), first fabricates the base silicon PIC with its optical waveguides and other passive components. This is a mature, high-volume process that does not need to change.

Polymer Deposition: After the base PIC is fabricated, the LWLG polymer is applied to the chip, typically through a process called spin coating. The polymer is a liquid solution that is spun onto the wafer to create a thin, uniform layer.

Patterning and Poling: The polymer is then patterned to create the active region of the modulator, and an electric field is applied in a process called poling. This aligns the polymer molecules, giving them their electro-optic properties.

Final Integration: The chip is then completed with the final metal layers and packaging.

The ability to use existing, high-volume foundry processes is a significant advantage. It means that companies don't need to retool their entire fabrication lines or scrap years of design work. Instead, they can simply add the polymer layer as a final, high-performance "ingredient" to their existing designs. This accelerates the path to market and significantly lowers the cost and risk of adoption.

Stabilizing Frequencies and Improving Performance
The second part of your question, regarding stabilizing frequencies and reducing the need for individual heater ICs, is also directly related to the "ease of integration" message.

Thermal Stability: As mentioned previously, silicon-based modulators, particularly MRRs, are highly sensitive to temperature changes. This is due to silicon's high thermo-optic coefficient, meaning its refractive index changes significantly with temperature. This requires a dedicated heater IC to constantly adjust and stabilize the resonant frequency of the ring.

LWLG Polymers: In contrast, LWLG's polymers have a low thermo-optic coefficient. This makes them far less susceptible to thermal drift. By integrating the polymer into the modulator, the transceiver can maintain a stable frequency with minimal or no active heating. This directly addresses the need for individual heater ICs, leading to:

Reduced Power Consumption: Eliminating the power-hungry heater ICs.

Simplified Design: Reducing the complexity of the chip and its control electronics.

Improved Reliability: Removing a source of potential failure and heat-related issues.

In essence, the "ease of integration" is not just a marketing phrase; it's a technical reality based on a manufacturing process that is designed to be foundry-friendly and additive. This approach allows transceiver manufacturers to leverage the performance benefits of LWLG's polymers without the cost and risk of a full-scale redesign.

[MarcoPolo4]

Anthony Yu joined NLM Photonics in the role of Strategic Advisor in March of this year. As you likely know, NLM is developing electro-optical polymers (although they use the term "organic materials" which is for marketing reasons and likely to differentiate from LWLG polymers). Why would Anthony Yu take on the responsibility for helping to develop partners and customer business for NLM if he didn't see polymers as the next material that can compete with legacy materials. He likely joined NLM because LWLG already hired Yves LeMaire.