Issued July 29th from STM:
In the frame of ST manufacturing reshaping program (refer to Corporate PCI 15383 - Early
Notification), following the continuous improvement of our service and to increase production
Capacity, ST Microelectronics is announcing the qualification of SG8 (Singapore) as FE
Location for the impacted Products in BCD9 BSM / BCD110 Technology.
Please be advised that the enclosed list of products and dates could be subject to change.
Such modifications may occur as part of the ongoing transformation program and will be
communicated as and when available.
ST will explore the scale up of this technology perimeter and products into 300mm (12”) in the
future in AG factory. Any timeline and specific communication would be done in future with
customers.
7.1 Date of qualification results 2026-07-15 Hope it's sooner...