Replies to post #220764 on Lightwave Logic Inc (LWLG)

[prototype_101]

Spartex, note in the quote you referenced Yves was speaking to the failed Lumera/GigOptix attempt to commercialize their Polymers some 20 years ago, Yves did so because this is what Mark L is basing his never-ending series of attacks on LWLG Polymers on, which is TOTAL NONSENSE, now NLM Polymers are much better than the old Lumera/GigOptix was too, but I guarantee you out of the 70+ Patents Lebby locked down the Intellectual Property and NLM cannot help but to be stepping all over LWLG's IP!!! also note that NLM is using an additional crosslinking step that enables super high temperature processing of 250 degrees, which will be needed for a second or two in the manufacture of CPO, at this point LWLG last published the trend of the Tg for LWLG at about 187 degrees at ECOC 2024, based on the trend line I believe LWLG would be over 200 degrees by now without crosslinking, and presumably the push to achieve Tg at 245-250 degrees would get LWLG there in the next couple of years before CPO becomes a commercial reality, for now as Yves pointed out LWLG Polymers will be used in Pluggable transceivers, and remember the tiny size of LWLG slot modulators could fit up to 120 of them into a Pluggable and extend the life of the Pluggables for years to come. CPO is much harder to service so DC's would prefer to stay with Pluggables if possible

here is more on NLM's crosslinking their POLYMERS

Disadvantages of Crosslinking in NLM Photonics' Materials
1. Reduced Electro-Optic Coefficient (r33?) 📉
One of the primary purposes of NLM's materials is their high electro-optic coefficient, which dictates how efficiently they can convert electrical signals into optical ones. Crosslinking, while beneficial for stability, can sometimes reduce this key performance parameter. For example, some materials might show a decrease from 460 pm/V without crosslinking to 290 pm/V with it. This trade-off between stability and performance is a significant consideration.

2. Potential for Increased Absorption (Optical Losses) 💡
Crosslinking can lead to a slight increase in optical absorption within the material. This means more light energy is lost as heat rather than being transmitted or modulated, which can reduce the efficiency of the photonic device. For instance, absorption might increase from <0.0001 to <0.0002 at a specific wavelength after crosslinking.

3. Processing Complexity and Specific Requirements 🧪
The crosslinking process adds an extra step to the fabrication of photonic devices. This step often requires specific conditions, such as:

UV light exposure: Many photo-crosslinking reactions are initiated by UV light, requiring specialized equipment and careful control of dosage and uniformity.

Photoinitiators: The use of photoinitiators can be necessary, and their choice affects the polymerization efficiency and the specific wavelength of light needed.

Oxygen inhibition: Photo-radical curing methods are often susceptible to inhibition by molecular oxygen, potentially leading to incomplete curing or tacky surfaces. This might necessitate an oxygen-free environment, adding cost and complexity.

Temperature control: While photo-crosslinking offers low-temperature processing advantages over thermal curing, precise temperature control during the reaction is still important.

4. Material Shrinkage and Heterogeneity 📏
The crosslinking process can induce shrinkage in the material as it forms a more compact network. This shrinkage can create stress within the device, potentially affecting its optical properties or long-term reliability. Additionally, chain-growth crosslinking can lead to a more heterogeneous network, which is also prone to more shrinkage and can reduce control over the final material properties.

5. Limited Design Flexibility in Some Cases 📐
Once a material is crosslinked, it forms a thermoset polymer, meaning its shape is largely fixed and cannot be easily re-melted or re-processed. This limits the ability to reshape or repair the material after crosslinking, which can be a disadvantage in certain manufacturing or application scenarios.