KCC, your honest admission and dirty perspectives that remain on several issues:
And yes, I was pushing for info from you because the low info crowd is being fed slop about readiness - and you yourself have repeated some comments from the engineer as well as Dr Lebby that give the wrong impression re readiness.
1. First - my question as to what is truly commercially ready now and what isn't.
You verified that they aren't commercially ready on the tech that people are here for. That's huge and I'll bet if I had said it half the people here would call me a liar. Individual modulators and materials alone aren't valuable. Maybe someday but they aren't close. It's the PIC/transceivers that could ramp up nicely and it isn't ready. As you just said clear as a bell.
Proto dishes out slop daily saying they are - by misleading with the 'we are commercially ready' messaging that doesn't apply to the high revenue potential products. Hopefully the low information crowd gets it finally. Integrity requires calling out those that mislead. I encourage you to do so more often than you do because (apparently) you are one of the few that can see through it.
2. You recently validated my immediate claim that Marcelli was the mystery 'high executive'. I can only wonder what Dr Lebby was thinking when he laughed when you told him what he said. It's disappointing that after the things you have said about your own lack of trust in him that you still shared the carrot with investors. Integrity comes to mind once again. Rememer my 10th prediction? We'll see.
3. At least twice now you have responded to my claim of only one 200mm wafer foundry to say there is more than one foundry without addressing the wafer size. Why do you do that? Careless or disingenuous? There has been no evidence of more than one foundry sending 200mm wafers, and Dr Lebby strongly implied AMF is the only one in an interview, and common sense supports it based on how/when it was reported. Concurrent runs from AMF can explain multiple 200mm wafers at the lab when you were there.
4. You are wrong to deny that the company said commercialization had begun in ASM 2021, so I have to call you out on that one as well, as the facts are clear and anybody can verify from the video presentation on YouTube.
You wrote:
ASM 2021 did not say commercialization had begun
This is demonstratably false.
Actual quotes from the ASM 2021:
16:08
We've been commercializing this.
18:56
Our portfolio of partners continues to increase as we get deeper into the commercialization process.
24:00
..our focus on deeper commercialization with selected customers.
24:40
[Question]:Do you have revenue guidance for 2021/2? [Answer]: We have internal models however we are not ready to provide guidance. [imo this was misleading: their internal models surely didn't include any meaningful revenue for either 2021 or 2022.
26:00
[Question - point blank]:When will this technology be commercialized? [Answer]:It's already in the commercialization phase and we are prototyping.
27:46
Our polymer business is being commercialized.
It's clear as a bell: They did say that commercializtion had already begun. The company has been talking about already commercializing or being 'ready for commercialization", or being in the 'commercialization process or phase" for years, including during the 2021 ASM. Even worse, the ASM 2021 led investors to believe that products were on the verge of being ordered for manufacture and mass commercialization - clearly supported with both Dr Lebby's words and tone throughout the entire presentation. While it was positive that they moved into foundries, the presentation now should be an embarrassment to the company and those that continue to defend it.
The question is why do you and other continue to stubbornly give them a pass on that? Facts are facts. Check them out yourself.
KCC said, Multichannel modulator PICs are apparently not ready. We just don't know because we haven't been told so. Multichannel modulator PICs are the only product that can provide significant revenue in the next few years. So yes...we really need the company to tell us more than "in progress".
What investors DO KNOW is that Multichannel modulator PICs ARE MOST DEFINITELY on the multitude of Wafers streaming into LWLG labs from Foundries on 3 continents!!! And investors also learned that these Multichannel modulator PICs were being SHIPPED OUT TO TIER 1's for testing/evaluation!!! And investors also know that it has been Lebby's long-standing Timeline goal to have these Multichannel modulator PICs optimized in 2024!!!!
So at ECOC when Lebby puts on his slideshow that LWLG is COMMERCIAL READY investors must believe that the Multichannel modulator PICs have been OPTIMIZED and ready for the MASS COMMERCIALIZATION that Lebby has proclaimed many times will make LWLG's technology UBIQITOUS!!!! Additionally, Lebby has also CONFIRMED that LWLG is working with the largest Transceiver companies in the world currently, all under NDA's of course!!
The Most Innovative Hybrid PIC/ Optical Integration Platform award goes to Lightwave Logic, Inc.
hey teddybear, Jose says EVERYBODY is talking about LWLG, what gives with that BFF contrarian journalist of yours who many here suspected was the kerrisdale klown poster on this message board, the kerrisdale klowns, you and your BFF will NOT be forgotten, you will getting your own awards for the destruction of shareholder value in the not too distant future!
ECOC 9/23/24 Lebby "Commercial silicon foundry 200mm wafers where EO polymers HAVE BEEN easily integrated using standard PDKs."
Our polymers are EASILY FABRICATED in silicon fabs 🡪 ideal for heterogenous integration!! (Slide 19)
ECOC - World class performance for 200Gbps PAM4 and 400Gbps PAM4 lanes from electro-optic polymer modulators
Michael Lebby, Lightwave Logic Inc
Electro-optic (EO) polymer modulators are a hot topic in the industry today as the industry strives to increase modulation speed while reducing optical network equipment power consumption, driven by G-AI needs to upgrade hypescaler datacenters. Polymer modulators are now showing world class performance for 200Gbps PAM4 lanes, with initial results at 400Gbps PAM4 lanes and headroom for 800Gbps lanes as polymers have significant bandwidth capability. This enables not only 4 channel by 200Gbps PAM4 lanes for 800Gbps pluggable transceivers today, but also 4 channel by 400Gbps PAM4 lanes for 1.6Tbps pluggable transceivers soon. Further, polymer modulators have the capability for 4 channel by 800Gbps PAM4 lanes for 3.2Tbps pluggable transceivers using 800G lanes as part of a technology roadmap plan. Recent world class EO polymers results include:
1) Clean PAM4 eye diagrams at 200Gbps with less than 1V drive voltage.
2) Super high bandwidth polymer based plasmonic devices that exceed 250GHz (EO S21 3dB) for 400Gbps PAM4 lane applications for4 channel by 400Gbps PAM4 (1.6Tbps) pluggable transceivers.
3) Very low voltage drive of ~0.5V (which allows direct drive from ICs, DSPs etc., and potentially can eliminate driver chips)
4) Very small footprint and size, which allows simple integration with PICs to turbo-boost silicon photonics. Tiny optical engines are ideal for pluggable and onboard-optic transceiver form-factors.
5) Commercial silicon foundry 200mm wafers where EO polymers have been easily integrated using standard PDKs.
The talk will discuss the latest world class results with commercial grade electro-optic polymer materials that are being licensed for device applications for datacom at 1310 and 1550nm. These devices are fabricated onto 200mm silicon commercial foundry wafers and perform to 200G lane specifications at drive voltages less than 1V (which supports the drive to lower power consumption). Packaged polymer modulators will show the latest reliability and lifetime performance for datacenter applications. Reliability and stability results will be presented to show the robustness of the technology platform with respect to thermal stability and photostability in testing on materials, packages, and boards. Plans for CSP (Chip Scale Packaging) for polymer PICs will be shown based on dielectric sealants such as Atomic Layer Deposition at temperatures suitable for organic, polymer material. The talk will also show how the performance of EO polymer modulators can extend to not only 800Gbps and 1.6Tbps transceivers, but also 3.2Tbps, 6.4Tbps and beyond using the natural bandwidth characteristics of Perkinamine® chromophore organic material family. With EO bandwidths that exceed 250GHz that have been demonstrated with Polariton, single line or lane data rates that exceed 800Gbps PAM4 possible which opens a path for multi-Tbps data rate pluggable transceiver designs that include 3.2Tbps and 6.4Tbps for an exciting technology roadmap using polymer materials.
We know NOW of course that it was just a 'process' but that was not understood at the time, and nobody with a brain can conclude they accidently misled people. And that's the crux of the problem with trust. I'll repeat that the presentation now should be an embarrassment to the company and those that continue to defend it. No long should ever defend that presentation anymore.
Unrelated, I will say that yesterday was intriguing...maybe something good leaked, but so far today there is no sign of follow through and the large sale which caused the stock to drop 20 cents in the afternoon yesterday made the whole move up appear less valid..