KillerCliff,
As far as I am concerned, I interpreted his reaction completely differently.
In my opinion , Seyedi after being confused that his position even needed to be cleared, confirmed in the second part of his answer that, what Lebby has been preaching for many years, is the only way forward for photonics! Gold boxes belong to the past and CMOS compliant ALD sealing is the way forward!
Indeed, in so far as hybrid integration is the gateway to high volume manufacturing, it is the single way forward to achieve what he dearly seeks : a way to lower systems / chips costs, by ensuring full compatibility with CMOS manufacturing environments.
That's what he says all along his interview on the panel, over and over again, sometimes quite provocatively to the panelists and/or the audience, and what he reaffirms after he makes sure he frames Lebby's question correctly.
The whole point of his presence on this panel, is that the old ways of doing photonics is not efficient, even if it sometimes delivers marginally more performant results, and needs to be changed so high volume manufacturing, packaging, testing can finally be implemented, and lift the whole industry to the level of maturity of electronics. In the end, he completely agrees with Lebby.
And as far as him, not knowing what is happening at LWLG, I think you should re-watch the portion of the interview when Pozo describes the advanced RF testing that he witnessed in the lab in Englewood, and watch Seyedi's shaking his head in approval, to the point that Pozo uses it to predict that he will tweak who he is going to invite to future Global Photonic Economic Forums, making sure to invite more RF tech CEOs... Obviously very impressive to the whole industry experts present...
That's my take.
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