From Ted's link (from NCBI back in Jan 2024) If the proposed reconfiguration option is viable ( https://www.ncbi.nlm.nih.gov/pmc/articles/PMC10831040/ ) IMO it is like turbo charging an already proven methodology for delivery but not really any new IP. Additionally, the supplier/Tester fabrication facility looks very familiar. Do you think that AMF as a partner to LWLG would not share and support these new methodology without including LWLG modulations?
Abstract Optical interconnects have been recognized as the most promising solution to accelerate data transmission in the artificial intelligence era. Benefiting from their cost-effectiveness, compact dimensions, and wavelength multiplexing capability, silicon microring resonator modulators emerge as a compelling and scalable means for optical modulation. However, the inherent trade-off between bandwidth and modulation efficiency hinders the device performance. Here we demonstrate a dense wavelength division multiplexing microring modulator array on a silicon chip with a full data rate of 1 Tb/s. By harnessing the two individual p-n junctions with an optimized Z-shape doping profile, the inherent trade-off of silicon depletion-mode modulators is greatly mitigated, allowing for higher-speed modulation with energy consumption of sub-ten fJ/bit
Methods Fabrication The Si MRM chips were fabricated at Advanced Micro Foundry (AMF), Singapore. The chips are based on industry-standard 220?nm thick Silicon-on-Insulator (SOI) wafers. The Z-shape junction was formed from Phosphorous (for n-type) and Boron (for p-type) implants. The uniformity of the Si MRM chips is shown in Supplementary Information V.
This is an interesting path for identifying the next leap of bandwidth into the 6.4TB levels.
Fire away with the prognostications or corrections to the assumption!