Can you provide a link, page number with quotes. Let me do a quick search of the 10-Q
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"Our Company has a fabrication facility in Colorado to apply standard fabrication processes to our electro-optic polymers which create modulator devices. While our internal fabrication facility is capable of manufacturing modulator devices, we have partnered with commercial silicon-based fabrication companies that are called foundries who can scale our technology with volume quickly and efficiently. The process recipe for fabrication plants or foundries is called a ‘process development kit’ or PDK. We are currently working with commercial foundries to implement our electro-optic polymers into accepted PDKs by the foundries. One of the metrics for successful implementation of PDK is to receive working modulator chips. Our work with the foundries is being focused with the Polymer Plus™ and the Polymer Slot™ polymer modulators."
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On June 24, 2021, we announced the receipt of U.S. patent number 11,042,051 that details a breakthrough new device design that enables mass-volume manufacturing when designed into advanced integrated photonic platforms. The device design enhances reliability, improves optical mode control and most important, lowers by consumption through the use of direct-drive, low-voltage operation. The patent is entitled, "Direct drive region-less polymer modulator methods of fabricating and materials therefor" and is expected to open the opportunity for low power consumption electro-optic polymers to be developed into large foundry PDKs (process development kits) and be ready for mass volume commercialization. The patent emphasizes our technology platform using fabrication techniques that would naturally fit into foundry PDKs.
On August 4, 2021, we announced that we developed improved thermal design properties for electro-optic polymers used in our Polymer Plus™ and Polymer Slot™ modulators, enabling the speed, flexibility and stability needed for high-volume silicon foundry processes. We successfully created a 2x improvement in r33, while allowing higher stability during poling and post-poling. This provides better thermal performance and enables greater design flexibility in high-volume silicon foundry PDK (process development kit) processes.
On August 9, 2021, we announced the receipt of U.S. patent number 11,067,748 entitled "Guide Transition Device and Method" that covers a new invention that enables enhanced optical routing architectures for polymer-based integrated photonics that can be scaled with partner foundries. This new invention will enable innovative, highly scalable optical routing architectures for integrated photonic platforms. The patent provides novel optical waveguide transition designs using two planes of optical waveguides that are expected to be critical for optical signal routing and optical switching, opening the opportunity for high speed, energy efficient electro-optic polymers to be implemented into foundry PDKs (process development kits) to improve the performance of integrated photonic circuits. This breakthrough technology opens the door for advanced integrated photonics architectural design. We believe the simplicity of the design is ideal for production in foundries and will best position our Company to enable increased data traffic on the internet while using less power.
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On January 3, 2022, we announced the publication of our patent application 20210405504A1 by the United States Patent and Trademark Office (USPTO) – entitled 'Nonlinear Optical Chromophores Having a Diamondoid Group Attached Thereto, Methods of Preparing the Same, and Uses Thereof' – which significantly improves the overall stability and performance of our electro-optic polymers. The Company's electro-optic chromophores are designed to have one or more diamondiod molecular groups attached to the chromophore. When such chromophores are dispersed in a host polymer matrix, the electro-optic materials result in improved macroscopic electro-optic properties, increased poling efficiency, increased loading as well as increased stability of these materials after poling. The impact of this technology is that it will accelerate the path for very high-speed, low-power electro-optic polymers to be implemented into large foundry process development kits ("PDKs”) to boost performance of integrated photonic circuits.
On January 3, 2022, we announced that we enhanced our Company’s Foundry Process Development Kit Offering with the addition of Optical Grating Couplers. This expanded design tool kit will enable silicon foundries to implement PDKs and fabricate modulators and optical gratings in a single fab run, further enhancing modulator efficacy. We are continuing to work on additional design tool kit components to enable an expedited commercialization process through a more simplified manufacturing process for our foundry partners.
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On June 21, 2022, we announced the publication of our patent application 2022/0187637A1 entitled "Hybrid electro-optic polymer modulator with silicon photonics" that details a novel fabrication process that allows our Company’s proprietary polymers to be fabricated by silicon foundries in a high-volume manufacturing environment. The published patent application also details a more efficient process that allows for high yielding, high stability poling of polymers in a high-volume foundry manufacturing environment. The development of the PDK for this new optical hybrid optical modulator design is now in progress with our Company’s foundry partners.
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On November 29, 2022, we announced our acquisition of the polymer technology and intellectual property assets of Chromosol Ltd (UK). The acquisition significantly strengthened our Company's design capabilities with foundry PDKs with extremely low temperature atomic layer deposition (ALD) processes that effectively hermetically seal polymer devices that have been prepared for high volume manufacturing. The advanced fabrication processes of ALD with temperatures below 100C will solidify our Company's market position with both the Company's manufacturing foundry partners as well as end-users as we prepare to enter the 800Gbps integrated photonics marketplace. The acquisition also advanced our Company’s patent portfolio of electro-optic polymer technology with an innovative polymer chemistry device patent that has potential to increase the performance of integrated modulators through optical amplification in a photonic integrated circuit (PIC) and enhance the functionality of the PIC by integrating laser light sources made using the polymer-based gain and a laser optical cavity defined on the Silicon photonic platform, with our Company’s high speed, high efficiency modulators. Having access to extremely low temperature ALD allows our Company's polymer modulators to be protected from the environment without the need for expensive and large footprint gold box packaging, propelling our Company forward with chip-scale packaging as required by major hyper-scaler end-users. The patent opens a new class of PICs which expands our variety of devices. The Patent is US patent number 9837794, EU patent number 3017489, China registration number 201480048236 & 201910230856, and is entitled, "Optoelectronic devices, methods of fabrication thereof and materials therefor.”
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As we move forward to diligently meet our goals, we continue to work closely with our packaging and foundry partners for 112Gbaud prototypes, and we are advancing our reliability and characterization efforts to support our prototyping. Depending on electrical encoding schemes such as PAM4, or PAM8, or wavelength optical multiplexing, these Gigabaud rates roughly translate to 200Gbps and 300Gbps per lane, and are the key speed rates for emerging 800Gbps to future possible 1200Gbps applications. Our partnership with silicon-based foundries will allow us to scale commercial volumes of electro-optic polymer modulator devices using large silicon wafers, and we are currently working to have our fabrication processes accepted into foundry PDKs (process development kits). These are the recipes that foundries use to manufacture devices in their fabrication plants.
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We expect that our cash used in operations will continue to increase during 2023 and beyond as a result of the following planned activities:
· The addition of management, sales, marketing, technical and other staff to our workforce;??
· Increased spending for the expansion of our research and development efforts, including purchases of additional laboratory and production equipment;??
· Increased spending in marketing as our products are introduced into the marketplace;??
· Partnering with commercial foundries to implement our electro-optic polymers into accepted PDKs by the foundries;??
· Developing and maintaining collaborative relationships with strategic partners;??
· Developing and improving our manufacturing processes and quality controls; and??
· Increases in our general and administrative activities related to our operations as a reporting public company and related corporate compliance requirements.??
Implement as in "put (a decision, plan, agreement, etc.) into effect."
Before you can implement something, it has to be developed, so as I look at it is developed. In my past life I used to implement many things and they were all developed before they were implemented.
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A Process Design Kit (PDK) is a library of basic photonic components generated by the foundry to give open access to their generic process for fabrication.
Designers can design a wide variety of photonic integrated circuits (PICs) using the photonic components of the foundry, which are technically and geometrically represented in their Process Design Kits.
A PDK can be compared to a set of building blocks, where each photonic component in the library is a separate block. A designer can use these blocks to build many types of photonic circuits for various applications. A generic technology is useful for reducing costs when the designer is using predefined, tested photonic components on the material platform of their choice.
A designer can also create his or her own building blocks, but the designer must follow the fabrication rules of the foundry to be able to use a custom component from a particular foundry. Among others, the rules usually include:
Material stack (types of layers and thickness)
Minimum distance between optical components (like gaps between waveguides)
Maximum etching depths
Metallization and electrical probes (how to place the metal, metal layers allowed)
Feature size (size of waveguides, holes, active areas, etc.)
How does a process design kit work, and why is it so important?
In photonics, the basic building blocks in a PDK are waveguides, phase shifters, active sections (semiconductor optical amplifiers or SOAs and lasers), and rotators (polarizers). These resemble the basic components in electronics, which are wires/resistors, inductors, capacitors, and transistors, shown in the following figure.
To model a photonic component, you need to consider material and optical properties. At the device level, these properties are usually:
The refractive index of the material stack versus the wavelength, represented by the real and imaginary part of it (also known as optical performance)
Values of pre-characterized components or validated components
Analytical models to predict the performance (when real data are not available)
The material and optical properties for the photonic component can be represented as a building block by the S-matrix; the S-matrix describes the signal transfer between the ports of the component from the device level to the circuit/layout level to simulate the PIC.
These building blocks are represented as white and black boxes. The black box is represented by a geometric shape, usually a rectangle with input and output ports, and it contains linear and non-linear models (or values from pre-characterized components) that represent the performance of the component; they are called black boxes because the designer can see only the input and output ports, while the foundry owns the relevant information of the component for fabrication. This information is loaded into the white box component when the foundry is assembling the mask (putting together all the photonic integrated circuit layout designs in the wafer) for fabrication. White and black boxes protect the foundry’s intellectual property because its process flow (masks, layers, and materials) cannot be seen by the designer.
Foundries use different material platforms, such as silicon photonics, InP, LiNbO3, polymer, and glass. Each material platform and foundry has (up to now) its own process flow or fabrication process which, based on the material and optical properties, determines the performance of the PICs at the physical level.
Designing a photonic integrated circuit (PIC) is not straight forward; its performance is linked to material and optical properties, which in turn are linked to geometrical shapes (light travels more or less efficiently in different geometries). The ability to design an efficient PIC comes with experience.
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