Dan,
The May deal was not fake or used to placate shareholders.
It took months to negotiate and supposedly a lot of time was spent negotiating making sure it was priced right and can be used as a template for future licensing opportunities. This isn’t hearsay, this is commentary from someone who had a discussion with Lebby about it in person recently. And no, not at the PECC conference.
It’s probably safe to assume the deal was executed around the time the end user finalized their own designs that necessitated the material, and the time that has passed since May was waiting on delivery of the wafers with said designs.
In October the material was delivered. Now, it needs to be processed with wafers/die, manufactured, packaged, sold, and shipped. It takes time.