Replies to post #148338 on Lightwave Logic Inc (LWLG)

[F2]

It’s truly a revelation. Just a matter of time before we see it in the open. Let me ask everyone just 1 question: think carefully.

What would this stock be worth in the immediate aftermath of this in the form of a public announcement?

Then, think, just how much fire are shorts playing with now? I bought an additional 11K shares today between my retirement and my daughter’s college account. This link is tremendous. And I could care less what shorts do to the stock in the short term. The revelation of what they are potentially against in the shape of ‘what’s next’ should literally keep them up at night…

Best to the longs,

F2

[prototype_101]

Allwillbe, we already know Intel and Ayar Labs are partners in development

https://community.intel.com/t5/Blogs/Products-and-Solutions/FPGA/Ayar-Labs-and-Intel-demo-FPGA-with-optical-transceivers-in-DARPA/post/1332623

now we know that LWLG will enable the Intel/Ayar MRR's

https://investorshub.advfn.com/boards/read_msg.aspx?message_id=172390283

White Paper - Hybrid Integration of Exotic Materials in CMOS Platform

This white paper marks the first direct evidence of a connection between GlobalFoundries, (Intel)Ayar Labs, and EO polymers. Note that LWLG is not referenced, however Carsten Eschenbaum, CTO of SilOriX, and Christian Koos are listed authors on the paper. We all know the connection to LWLG and SilOriX and Christian Koos.

Deniz Onural is at Boston University in their Silicon Photonics Lab. Hayk Gevorgyan is a Senior Photonics Device Engineer at Ayar Labs. Milos Popovic is also at Boston University and a co-founder at Ayar Labs.

This paper describes the BEOL process for integrating EO polymers in ring modulators on wafers supplied by GlobalFoundries.

Title: “Towards Hybrid Integration of Exotic Materials in an Electronic-Photonic CMOS Platform via Substrate Removal”

Abstract: “We demonstrate direct access to the silicon device layer of a monolithic CMOS electronics-photonics platform with a full-digital back-end-metal stack, in post-fabrication at die level, allowing the integration of functional materials (e.g. into slot waveguides).”

Paper requires payment to view. For those extra curious who want to read the details, go ahead and support Optica by purchasing the white paper.

-KCC

https://opg.optica.org/abstract.cfm?uri=CLEO_SI-2023-STh3H.4

Reddit link >> https://www.reddit.com/r/LWLG/comments/154a4rw/white_paper_hybrid_integration_of_exotic/