Which includes a quote from Anthony Yu, vice president of Computing and Wired Infrastructure at GlobalFoundries. “We are successfully using silicon photonics in complex and challenging solutions and have demonstrated our ability to build new solutions to scale for data centers.”
"Moving at light speed with silicon photonics Historically, photonics has been used with a different type of semiconductor chip. But GF innovators have been able to make the material work at scale with 300 mm-based silicon wafers, taking advantage of the large-scale foundry experience in complementary metal–oxide–semiconductor (CMOS) manufacturing.
“GF has discovered a way to combine photonics on the same chip as high-speed CMOS to move data,” Yu added. “Our solutions are using photonics within data centers, between data centers and now between chips at data rates eight times higher per channel.”
At its annual Technology Summit, held virtually on Sept. 15, 2021, GF extended its silicon photonics manufacturing leadership by announcing that its new Silicon Photonics Solutions 45nm platform has passed critical technology milestones and is on track for full technology qualification by the first quarter of 2022. The monolithic platform, combining radio frequency (RF) CMOS and optical components on the same chip, includes availability of the first micro ring resonator (MRR) optical component in 300 mm wafer technology. GF is engaged with leading partners on this new platform."
and, "Power delivery – Better data center performance while saving power Conventional power delivery solutions account for significant power loss in data centers, limiting the speed that they can process and analyze data. GF’s BCD/BCDLite smart power delivery solutions address that problem head-on, making it possible to realize power efficiencies that translate into better data computing and artificial intelligence (AI) performance. By doing more with less hardware, GF technology is reducing data center operating budgets, which cost companies more over the long-term than their initial hardware investment.
The inefficiencies of a conventional, discrete, component-based solutions limit processor performance. GF’s customization of power delivery solutions with market leaders and drivers enables low on-resistance (Ron) switching devices, high current inductors and high-density capacitors. These GF solutions are unique in that they are enabled in the same technology platform optimized for data center power delivery.
To learn more about how GF solutions are addressing the needs of the data center industry, please click here." Enjoy, AR.
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