I think we are talking about here, at least I am, Li/LQMT/Eontec et alia, using CIP IP and LQMT alloys for CE application without Apple's permission. I can see grounds for conflict here, am I the only one? If Li has already negotiated Apple into a deal, fine. But there is virtually no evidence of that. Can Li use the CIP and alloys from CIP to build a phone case for Samsung, Turing, whatever? How about if the case of BMG is integral to the transmission, jackless earpieces, etc. The agreements with Apple are hundreds of pages long, legal hell, that only companies like Apple can afford to navigate. And create.
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