i'll shoot from the hip; idcc did the RF design on a SiP module. some customer wanted small, super flexible radio solution--"WLAN, Bluetooth, GPS, WiMAX, GSM CDMA, 3G, HSPDA"--and idcc and Insight could handle the job as a partnership.
insight needed financing--or project funding--and idcc owns the solution. RF design involves black magic, radiation and emission physics. the SIP would need FCC approval, etc... idcc knows RF and Insight knows SIPs.
it's possible, that somebody could supply such a SIP as an ODM; assembling the module and selling it as a finished product. however, they'd need to mark up each componenet for a viable corporate profit. therefore, the handset maker could supply the chips to the module manuf., and then pay an assembly and value-added cost.
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