News Focus
News Focus
Followers 115
Posts 21872
Boards Moderated 1
Alias Born 04/22/2010

Re: MarcoPolo4 post# 219631

Thursday, 07/17/2025 8:25:59 AM

Thursday, July 17, 2025 8:25:59 AM

Post# of 236508
worth another LQQK, I searched for whether any TFLN devices have met this high standard of the Telcordia GR-468 85/85 stress test and I could not find any. With the manufacturing hurdles TFLN offers, if you can't prove the gold standard of reliability than you will mostly lose out to other materials and devices that can.

As KC said yesterday, OpenLight Photonics passed Telcordia guidelines for all active components its PDK. They announced this in March 2025. They mostly rely on indium phosphide to improve their photonic integrated circuits. Smart outfit I would say avoiding TFLN.

When I searched for OpenLight Telcordia testing, I did not mention LWLG but Open AI has already added that LWLG has done so as well in the OpenLight search that I did. LWLG has clearly made a statement that is hard to ignore.

Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers

Performance

Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)

LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)

Integration

Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)


LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost


Processing

Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.

LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc

Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf

Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
Bullish
Bullish
Volume:
Day Range:
Bid:
Ask:
Last Trade Time:
Total Trades:
  • 1D
  • 1M
  • 3M
  • 6M
  • 1Y
  • 5Y
Recent LWLG News