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Re: Lrc15 post# 218429

Monday, 06/16/2025 6:36:22 AM

Monday, June 16, 2025 6:36:22 AM

Post# of 219782
Lrc, it is very unprofessional of Mark to be name calling with words like "mob" and cult" while personally soliciting investors on LinkedIn to further push that agenda on a personalized basis, I have heard of others who have received his invitation as well, to me it sounds like he must somehow be profiting off of 1) promoting TFLN and 2) dissing LWLG, investors have heard the EXACT OPPOSITE from Yves who Mark claims to respect greatly, Yves has told investors that EVERYONE is interested in LWLG's technology, and Yves talking to Slide 10 said there were 20 companies in the pipeline and 10 companies in Stages 1 or 2 already with LWLG, the goal being 3 to 5 Tier 1 companies in Stage 3 by the end of 2025, so there is a great divide from what Yves, the CEO of LWLG, tells investors versus the Mark is apparently trying to sell investors to believe, also I noticed Mark FAILED to address the question asked about the DIRECT COMPARISON of LWLG Polymers to TFLN as referenced to Slide 13 of Yves 2025 ASM presentation, again seems very unprofessional to me for Mark to be on such a crusade, even teddybear is climbing back in bed with Mark this morning I see, so teddybear, why don't you and Mark talk to the Slide 13 here it is again for both of you to address

Thin-Film LiNbO3 (TFLN) versus LWLG Electro-optic Polymers

Performance

Thin-Film LiNbO3 (TFLN)
- r33 intrinsically capped at ~ 31 pm/V at 1310 nm
- n = 2.2, er = 30 (high dispersion across frequencies)

LWLG Electro-optic Polymers
- No intrinsic cap on r33 (> 200 pm/V at 1310 nm easily achieved)
- n ˜ 1.9, er ˜ 3-6 (low dispersion across frequencies)

Integration

Thin-Film LiNbO3 (TFLN)
- Integration with Si/SiN very low yielding & basically still in R&D stage
- Limited wafer size (150 mm)
- Large device footprint (sub-cm scale)
- High material cost w/ only one supplier (NanoLN)


LWLG Electro-optic Polymers
- Fully Si compatible
- Easily scalable to 300 (+) mm wafer
- Very small device footprint (sub-mm scale)
- Low material cost


Processing

Thin-Film LiNbO3 (TFLN)
- Thin film uniformity becomes difficult as wafer size scales up
- Specialized processing/tools needed – leads to higher costs
associated with processing, QC, etc.

LWLG Electro-optic Polymers
- Spin-coating produces films with high uniformity
- No specialized processing/tools needed (completely compatible
with existing Si foundry processes/tools) – reduces costs
associated with processing, QC, etc

Slide 13 from 2025 LWLG ASM presentation found here,
https://irp.cdn-website.com/a5f8ef96/files/uploaded/2025_ASM_Presentation_-_FINAL-40e13d6a.pdf

Where are you Mark Lutkowitz? Here I even DETAILED the differences Yves pointed out on Slide 13 here for you!!!!
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