Lightwave Logic Inc (LWLG)

[prototype_101]

Lebby Podcast--->"Failure Mechanisms" = Qualification of 4x200 PIC

Lebby's Podcast----> SMOKING GUN PROOF OF LATE-STAGE QUALIFICATIONS

Investors also learned from the Podcast just before Lebby's abrupt departure that LWLG was proving out to be MORE ROBUST than even Lebby thought it could be in FAILURE MECHANISMS testing which is part of the QUALIFICATIONS PROCESS

In this Podcast released practically coincident with Lebby's abrupt departure from LWLG over the dispute with the BOD on "Business Strategy" investors learned that Lebby found that LWLG tech was more robust than even he had ever imagined in the final set of tests for the Tier 1 Customer Acceptance requirements on "Failure Mechanisms"

NOTE >>> FAILURE MECHANISMS testing is part of the QUALIFICATIONS PROCESS


Lebby at 13:45 "Is it robust? is it reliable? is it stable? so we are actually at Lightwave really doing a lot of Reliability, Accelerated Testing, Lifetime Work, in terms of different temperatures, looking at different techniques, you know, trying to really understand how robust this material is, and actually we've been positively surprised, this is more robust than we expected, and we're really excited, and we're in the mode right now of conveying that to the Industry, we're very happy with the performance, we see this as a long-term solution for the Industry in terms of performance, and how this can add value to the optical network, but those are the things we're working on really hard, and as you bring a new technology platform to market, where either you've increased the performance or you've changed the technology itself, you've got to go through these things, and certainly we're going through all of that"

Gemini, is study of Failure Mechanisms part of Qualifications work for Transceiver components such as modulators?

Yes, the study of failure mechanisms is an essential part of the qualification work for transceiver components like modulators. Here's why:

Reliability Prediction: Understanding failure mechanisms allows engineers to predict the long-term reliability of the component. This is crucial for ensuring that the transceiver can operate reliably in demanding environments for its intended lifespan.

Failure Analysis: When a component fails during testing or in the field, analyzing the failure mechanism helps pinpoint the root cause. This information is vital for:

Design Improvements: Modifying the component's design to address the identified weakness and prevent future failures.

Manufacturing Process Refinement: Identifying and correcting issues in the manufacturing process that may be contributing to failures.

Accelerated Life Testing: By understanding the dominant failure mechanisms, engineers can design accelerated life tests that simulate the effects of long-term operation in a shorter timeframe. This allows for faster evaluation of component reliability.


Common Failure Mechanisms Investigated in Modulators:

Electro-migration: The movement of metal atoms within the component due to high current densities, potentially leading to open circuits.

Electromigration: The movement of metal atoms within the component due to high current densities, potentially leading to open circuits.

Dielectric Breakdown: Failure of the insulating layers within the component due to excessive electrical stress.

Thermal Cycling: Repeated exposure to temperature extremes can cause material fatigue and lead to cracks or delamination.

Optical Degradation: Aging effects that can degrade the optical performance of the modulator, such as changes in refractive index or absorption.

Techniques Used to Study Failure Mechanisms:

Accelerated Life Testing: Subjecting components to extreme conditions (e.g., high temperature, high humidity, high voltage) to accelerate the aging process and observe failure modes.

Failure Analysis Techniques: Using tools like scanning electron microscopy (SEM), energy-dispersive X-ray spectroscopy (EDX), and focused ion beam (FIB) to examine failed components and identify the root cause of failure.

Modeling and Simulation: Using computer simulations to predict the behavior of components under different operating conditions and identify potential failure points.

By thoroughly investigating failure mechanisms, component manufacturers and transceiver makers can significantly improve the reliability and longevity of their products.

I even COLOR CODED the PROOF that LWLG is working on QUALIFICATIONS with the LARGEST TRANSCEIVER COMPANIES on 3 CONTINENTS based on what Lebby has told us in this podcast, ANYONE can see that Gemini has listed the same items as I COLOR CODED IN GREEN as items done in QUALIFICATIONS that Lebby spoke of in his PODCAST!!!!

Gemini, how long do qualifications generally take?

The duration of qualifications for transceiver components like modulators can vary significantly depending on several factors:

Component Complexity: More complex components with intricate designs and demanding performance requirements will naturally take longer to qualify.

Stringency of Requirements: The tighter the performance specifications and reliability requirements, the more extensive and time-consuming the qualification process will be.

Testing Scope: The number and types of tests performed during qualification will impact the overall duration. This includes electrical, optical, environmental, and reliability tests.

Collaboration and Communication: Efficient communication and collaboration between the component manufacturer and the transceiver maker can streamline the process and reduce delays.

General Timeframe:

While it's difficult to provide a precise timeframe, qualification processes for transceiver components typically range from several weeks to several months. In some cases, particularly for high-speed, high-performance components, the process may extend beyond six months.

Key Stages and Their Duration:

Initial Testing and Evaluation: This initial phase involves basic performance characterization and preliminary testing to assess the component's suitability. It can take several weeks.

Detailed Testing and Analysis: More in-depth testing is conducted, including environmental stress tests, reliability assessments, and failure analysis. This stage can take several weeks or even months.

Iterative Refinement: Based on the test results, the component may undergo design or manufacturing process modifications. This iterative process can extend the qualification timeline.

Final Qualification and Approval: Once all tests are passed and performance requirements are met, the component is formally qualified for use in the transceiver.

Factors that can Impact Duration:

Unexpected Issues: Encountering unforeseen problems during testing can significantly delay the process.

Resource Availability: Limited access to testing equipment or personnel can also impact the timeline.

Communication Challenges: Inefficient communication between the involved parties can lead to delays and misunderstandings.

By carefully planning the qualification process, addressing potential challenges proactively, and maintaining open communication between all stakeholders, it's possible to minimize the overall duration while ensuring that the final product meets the highest standards of quality and reliability.

Please keep in ming that Lebby has been working with the largest Transceiver makers on 3 continents, but that the deals are "taking a little longer than expected" because of the stubbornness of Lebby to extract FULL VALUE in NEGOTIATIONS with the Tier 1's, remember LWLG ELIMINATES the power hungry and EXPENSIVE Driver chip!!!

NOTE---> The Driver chip costs the Transceiver maker MORE than the price buying the LWLG modulator!!!!

Lebby said to the Benzinga (Nov 14th 2024) question on the commercialization status,

we've had a lot of interest from Tier 1 companies since then, I've given a few talks and a few updates, but what I can say today is that we have deepening relationships with these folks, and they are not just in the U.S., they are in Europe, as well as in Asia, and so this is interest level, these companies include some of the world's biggest Transceiver component manufacturers

we've been in deep discussions with this, and I'm working very very hard to put together Commercial Agreements on that, and this is something that I've indicated to our shareholders that is taking a little longer than it was expected, but it's also really exciting because now you can start thinking about the scale of our technology, so this is happening and I'm working really hard on it

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