Sunday, April 21, 2024 11:31:26 PM
To All the Smart Tech Gurus on this Board.....
Is this the BIG reveal we are all waiting on mid 2024......... will this be the Joint PR
Jeunke you had discussed this in your post #186900 that Marvell would be releasing ground breaking data center transceivers mid 2024......
Marvell Technologies announcing groundbreaking data center transceivers mid 2024 using 200 Gbps per lane and silicon photonics. Now who would be able to supply 200 G per lane modulators on a silicon photonics platform? I know only of one company! Marvell delivers its products to Google, Microsoft and AWS and they are projecting a gigantic datacenter TAM between 2023 and 2028 from 21 B to 75 B. None of these huge developments are included in the analyst projections. ‘The market’ doesn’t know ( yet).
https://investor.marvell.com/2024-03-25-Marvell-Demonstrates-Industrys-First-200G-3D-Silicon-Photonics-Engine-to-Scale-Accelerated-Infrastructure
Marvell Demonstrates Industry's First 200G 3D Silicon Photonics Engine To Scale Accelerated Infrastructure
The industry's first SiPho Engine with 200 Gbps electrical and optical interfaces, the device delivers 2x the bandwidth and 30% lower power per bit versus comparable devices with 100 Gbps electrical and optical interfaces.
SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will demonstrate its 3D Silicon Photonics (SiPho) Engine this week, the industry's first highly integrated SiPho engine featuring 32 channels of 200G electrical and optical interfaces for connecting next-generation AI clusters and cloud data centers at multi-terabit speeds.
The 200 Gbps device delivers 2x the bandwidth, 2x the input/output (I/O) bandwidth density, and 30% lower power per bit versus comparable devices with 100 Gbps electrical and optical interfaces1.
Device integration and greater bandwidth input/output (I/O) density provide a pathway for producing a wide spectrum of optical interconnects optimized for different use cases and form factors ranging from pluggable modules to future co-packaged optics (CPO).
The demonstration will take place at OFC 2024 this week in San Diego, California.
Is this the BIG reveal we are all waiting on mid 2024......... will this be the Joint PR
Jeunke you had discussed this in your post #186900 that Marvell would be releasing ground breaking data center transceivers mid 2024......
Marvell Technologies announcing groundbreaking data center transceivers mid 2024 using 200 Gbps per lane and silicon photonics. Now who would be able to supply 200 G per lane modulators on a silicon photonics platform? I know only of one company! Marvell delivers its products to Google, Microsoft and AWS and they are projecting a gigantic datacenter TAM between 2023 and 2028 from 21 B to 75 B. None of these huge developments are included in the analyst projections. ‘The market’ doesn’t know ( yet).
https://investor.marvell.com/2024-03-25-Marvell-Demonstrates-Industrys-First-200G-3D-Silicon-Photonics-Engine-to-Scale-Accelerated-Infrastructure
Marvell Demonstrates Industry's First 200G 3D Silicon Photonics Engine To Scale Accelerated Infrastructure
The industry's first SiPho Engine with 200 Gbps electrical and optical interfaces, the device delivers 2x the bandwidth and 30% lower power per bit versus comparable devices with 100 Gbps electrical and optical interfaces.
SANTA CLARA, Calif., March 25, 2024 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions, will demonstrate its 3D Silicon Photonics (SiPho) Engine this week, the industry's first highly integrated SiPho engine featuring 32 channels of 200G electrical and optical interfaces for connecting next-generation AI clusters and cloud data centers at multi-terabit speeds.
The 200 Gbps device delivers 2x the bandwidth, 2x the input/output (I/O) bandwidth density, and 30% lower power per bit versus comparable devices with 100 Gbps electrical and optical interfaces1.
Device integration and greater bandwidth input/output (I/O) density provide a pathway for producing a wide spectrum of optical interconnects optimized for different use cases and form factors ranging from pluggable modules to future co-packaged optics (CPO).
The demonstration will take place at OFC 2024 this week in San Diego, California.
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