1. Patent allowance for HYBRID EO POLYMER MODULATOR WITH ALD SEALANT LAYER. The USPTO website has been redesigned and I am still exploring but it looks like this was allowed. Approximately 4 months from now to allow for admin processing and fee payment pending and it should be issued.
United States Patent Application 20220187638
Kind Code A1
Lebby; Michael ; et al. June 16, 2022
HYBRID EO POLYMER MODULATOR WITH ALD SEALANT LAYER
This patent gets after easier poling and manufacture at scale: Excerpts: " EO polymer can be conveniently poled"..... and "EO polymer modulator that can be easily encapsulated at the wafer level and easily diced while protecting window integrity."
2. On the other hand, it seems one patent application that was recently allowed (April 8, 22) was abandoned for failure to pay dues by (July 8, 22).
This can be easily rectified, and I expect/hope it will be, but it delays the official issuance of patent 17/121,118 | 6341-A14: HYBRID EO POLYMER MODULATOR WITH SILICON PHOTONICS
As always GLTA
Market Data 
Markets 
AI
