Lightwave Logic Inc (LWLG)

[prototype_101]

Actually sounds to me like LWLG can already produce substantial volume of chips/quarter metric, they have already benchmarked themselves equivalent to "competitive modulator chip suppliers" and that is only using one shift, they can always add shifts, and then they can add equipment to easily expand from where they stand today

https://investorshub.advfn.com/boards/read_msg.aspx?message_id=148903243

I think perhaps the most interesting thing now to me is the topic of how rapidly the Industry is moving to Co-packaged optics

ASM Q&A at about 1:01:01 Dr Lebby talks about how LWLG's technology is perfectly positioned for the Photonics Industry's rapid trend towards CO-PACKAGING

Listen to what Dr Lebby's said, "co-packaging is where you bring the optics right next to the electronic chip, the CMOS chip, in fact, you put it actually on the chip, so you want to make that inter-connect as short as you can, so that the interaction between the electronics and the photonics is as close as possible, and if you think about our technology for a second, we've got a spin-on polymer technology that you can spin on to IC's and CMOS, so we are ideally positioned to harness the co-packaging trend that is occurring, so yes, I am watching the competition in terms of the materials and the performance of the devices, but we're also watching how it gets packaged together, and we are actually ideally positioned for this new trend that's just occurring where other technologies are going to suffer, and so yes it's not just the materials, it's not just the device's but you have to look at the packaging too, and you have to look at where all the fronts are, and where the technologies are progressing and at what rate, and the conclusion is that mother nature is working with us on a number of different fronts, and that's really really exciting!

Ok, so I was thinking back to the presentation Dr Lebby gave at the PIC conference back in March 2019, and Slides 10 and 29 were all about this coming Industry shift to co-packaging,

Slide 10 just shows the migration from today's "Pluggable Optics" then to ---> "On-Board Optics" then to "Co-Packaged Optics"

Slide 29 shows an MCM (Multi-Chip Module), this was the one slide of that presentation that I focused on as likely most important, and what it is showing is LWLG's device packaged right onto the top of the MCM co-packaging Optics/Electronics

https://lightwavelogic.com/Profiles/Investor/Investor.asp?BzID=2252&from=du&ID=70101&myID=16524&L=I&Validate=4

Dr Lebby has always said the PIC/P2IC's would be a partnering build for OSA's, so I am wondering if there is possibly already a partnering deal in the works for this, and perhaps it also would be pending these ongoing reliability/durability testing