They don't even have the fab capacity for chipsets at this time.
Do you know if AMD's 200mm Fab can be converted to 300mm? That would put it off line for about 1.5 years if Intel's F12 conversion is typical. But who's to say what's typical? I think that is the only conversion so far. If their fab isn't realistically convertible, might they be looking at a way to reuse that capacity once processors have moved to 65nm? When will we get to SOCs where everything will be on a single die and there won't be any use for older generation capacity?
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