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Thanks for posting this right away tcubed! Some observations from a non technical, average Joe....
slide 11.
Surprised to see the projected TAM for Automotive ( LiDAR) is soooo huge, second only to Fiber Comms
It appears to be quite some time away if proven out, but might already fall under the "Filing" column re Patents (slide 17)
slide 25.
I wonder if ML is indirectly showing us that there are currently 3 foundries piloting the PolymerPlus as it appears to my eye the PP illustration is stacked in a column of 3...?
slide 26.
"Current engagement includes foundry partnering
In Progress---->>Foundry Partnering in BOLD type (next slide Global Foundries first to be listed?)
slide 29.
One could come to the assumption that next gen perk (PkM-4) could be the formulation that is in the patent "Filing" column, hopefully the one needed to address LiDAR! I believe ML will focus as much of his energy as possible to moving forward this potentially blockbuster application.
Exciting times...indeed!
"By 2025, we expect machines to generate 99 percent of the data created each year."[/I]
Now re watch LWLG's Corporate Video...https://www.lightwavelogic.com/investors/
"It's The Solution That Data Communications And Telecommunications Markets Desperately Need....The Transmission Of Data At Higher Speeds With Less Power"
Very happy to be a LWLG shareholder!
my final AMAT related post today, I promise...:)
Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as Classic Moore’s Law Scaling Slows
by Nirmalya Maity, Ph.D.
Sep 02, 2021
Advanced Packaging Proving Ground
We bring these technologies together at our Advanced Packaging Development Center in Singapore—a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It’s where we enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding (see Figure 2). The Center gives us a unique ability to co-optimize process technologies and fully validate their robustness with test vehicles.
Figure 2:
Polymer RDL/Si Interposer...??
https://blog.appliedmaterials.com/heterogeneous-design-and-advanced-packaging-enable-advances-ppact-even-classic-moores-law-scaling
APPLIED MATERIALS AI(X) PLATFORM HARNESSES THE POWER OF BIG DATA AND AI TO ACCELERATE SEMICONDUCTOR TECHNOLOGY BREAKTHROUGHS FROM LAB TO FAB
SANTA CLARA, Calif., April 05, 2021 (GLOBE NEWSWIRE) -- Applied Materials, Inc. today announced AIx TM, an innovative platform that accelerates the discovery, development and commercial deployment of new chip technologies........
https://www.appliedmaterials.com/company/news/press-releases/2021/04/applied-materials-aix-platform-harnesses-the-power-of-big-data-and-ai-to-accelerate-semiconductor-technology-breakthroughs-from-lab-to-fab
_______
"from lab to fab"...has a nice ring to it.
A great read...
The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips
by Sundar Ramamurthy, Ph.D.
Sep 08, 2021
Applied Materials today held its third Master Class of the year, focusing on two important and fast-growing areas of the semiconductor industry: ICAPS and advanced packaging. ICAPS stands for IoT, Communications, Automotive, Power and Sensors. ICAPS encompasses all but the three most advanced nodes in foundry-logic. Advanced packaging is about heterogeneous design, which is increasingly being adopted by semiconductor and systems companies to drive their power, performance, area/cost and time-to-market (PPACt™) roadmaps as classic Moore’s Law 2D scaling slows.
........
........
Into The Fourth Era Of Computing
In 2018, machines generated more data than humans for the first time. We believe this milestone marks the beginning of the fourth era of computing whereby the Internet of Things (IoT), Big Data and AI are creating a new wave of growth for the semiconductor industry, complementing the markets for PCs and smartphones which defined the second and third computing eras (see Figure 1). By 2025, we expect machines to generate 99 percent of the data created each year.[/I]
https://blog.appliedmaterials.com/fourth-era-computing-needs-more-advanced-logic-and-memory-chips
________
Foundries need to work hand and glove with (AMAT) years before their products come to market, their magical machines make our world possible!
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Job Title Photonic integrated circuit engineer
Company Name
Lightwave Logic, Inc.
Location
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Actively recruiting
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Job Title Integrated photonics project leader
Company Name
Lightwave Logic, Inc.
Location
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Actively recruiting
Posted 1 week ago
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A cool quick read....
All in all, “we are laying the groundwork for our vision of the future: a global array of photonic quantum computers, networked over a quantum Internet,” says Weedbrook.
First Photonic Quantum Computer on the Cloud
Toronto-based Xanadu suggests its system could scale up to millions of qubits
CHARLES Q. CHOI 09 SEP 2020 4 MIN READ
https://spectrum.ieee.org/photonic-quantum
Love it! Thumbs up!
INTEL is going all in on Fabs (to the tune of $44B)...
"The next steps in Intel’s playbook include a chip so efficient that the company didn’t measure it in nanometers but with an even smaller unit of measurement called the angstrom. Intel said the 18a, which is in development for 2025, will accelerate the company past its competitors."
hmm?
https://www.cnbc.com/2021/11/06/how-intel-plans-to-catch-up-to-samsung-and-tsmc-with-44-billion-of-new-global-chip-fabs.html
Luv it, Thx X
Prior to JDSU, he was co-founder and general manager of United Technologies Photonics (UTP), a high-speed optical modulator company, and held research management positions at United Technologies Research Center (UTRC)
Hmm, don't remember that but I like it!
Nrdc2,
I'm just fine with innumerable "investor showcases" while simultaneously engaging with "Tier Ones. The more investors that put LWLG on their watch list as a result of these "investor showcases" the higher the move will be when the "news" hits the airwaves and the "Buy" buttons are clicked.
I understand where your coming from, but wouldn't we all be bitching if ML wasn't doing enough to raise awareness of the company? I'm as guilty as anyone for bitching over the years, but as you say, I'm grateful for where we are today and my bitching is over. So keep spreading the gospel Michael, while we wait...:)
"I believe you meant "additive" to silicon".
Broadly speaking yes, but if you search " photonic chips " you can see a result of:
"The technology of such devices is called integrated optics. Photonic integrated circuits are usually fabricated with a wafer-scale technology (involving lithography) on substrates (often called chips) of silicon, silica, or a nonlinear crystal material such as lithium niobate (LiNbO3)."
If ML has his way, polymer photonic chips will be included above!
This is interesting:
https://pubs.rsc.org/en/content/articlelanding/2015/lc/c5lc00670h
"The chip is entirely made from polymers, enabling the use of the devices as low-cost disposables. The microgoblet cavities feature quality factors exceeding 105 and are fabricated from poly(methyl methacrylate) (PMMA) using spin-coating, mask-based optical lithography, wet chemical etching, and thermal reflow."
The global chip industry has a colossal problem with carbon emissions
PUBLISHED WED, NOV 3 20213:42 AM EDT
Energy intensive processes
"Several aspects of the semiconductor production process require vast amounts of power, according to Forrester analyst Glenn O’Donnell.
To begin with, the chipmakers need to take raw silicon (i.e. sand), melt it down, purify it, and then “grow” the silicon “rods,” O’Donnell told CNBC. “The furnaces [needed] to do this are extremely energy hungry,” he said.
The rods of purified silicon are then “sliced like deli meat into thin wafers,” upon which chips are built, O’Donnell added.
Various materials are layered onto the wafers in a series of steps that use energy intensive equipment. Diffusion furnaces, ion implanters, and plasma etching-machines all need considerable amounts of power, O’Donnell said, adding that some require very high temperatures.
The diffusion furnaces, for example, run at 1,200 to 2,000 degrees Fahrenheit and the wafers sit in them for hours at a time to change the surface characteristics of the silicon."
https://www.cnbc.com/2021/11/03/tsmc-samsung-and-intel-have-a-huge-carbon-footprint.html
*******
If only there were an alternative to silicon....:)
Team 1 White Paper:
Future Needs & System Impact of Microelectronics Technologies
July 2017
A good White Paper read from 2017 by NDIA (National Defense Industrial Assoc.)
Slide 11 showing....
Photonics Layer
________________
PIC Chip optical-bus
https://www.intrinsix.com/hubfs/Premium_Content/trusted-asic-design/Future_Needs_and_System_Impact_of_Microelectronics_Technologies.pdf
Side note:
Looks like CEVA snatched up a little company for a mere $33M in May that plays an important role in chip design, Intrinsix Corp. Global Foundries is shown as one of their clients on it's homepage, FWIW
https://www.intrinsix.com/blog/ceva-to-acquire-intrinsix-corp.-expanding-its-offering-to-include-full-turnkey-ip-platforms
Thx Xena, Did the analyst mention CEVA? I only caught bits and pieces of the audio interview and wasn't able to view the CNBC video (not a PRO subscriber).
CEVA home page kinda gives a sense of why their is a chip shortage, GPS shoe sole inserts, Cybershoes....?? That's new to me. Just think this only represents a small fraction of total connected products in the world. Really an exciting time to be alive.
Never even heard of CEVA until you pointed it out, I will check it out.
Did anyone else hear the Goldman analyst (Sung Cho) speaking about Marvel a little past 1 pm with Kelly Evans on CNBC? My AirPods perked up when he said something to the affect "customizable silicon chips are coming". hmm??
Wonder what "customizable" means???
https://www.cnbc.com/video/2021/11/01/watch-cnbcs-full-interview-with-goldmans-sung-cho-on-future-tech-leaders-to-watch.html
Interesting jeunke22, I read a tweet this weekend that said "bitcoin mining will do to energy what streaming did to broadband and data centers" point being, energy demands will only increase globally going forward and those that can offer solutions to this problem will reap the rewards IMO....:)
GlobalFoundries Inc (GFS) priced a full-size deal of 55.0mm shares at $47.00 (high-end of the range) and will debut on Thursday. #IPO $GFS
Image
12:34 AM · Oct 28, 2021·TweetDeck
Silicon photonics is a powerful platform, offering efficient mass production of photonic circuitry at high yield and low cost. Silicon as an optical material, however, falls short of certain properties that are indispensable for high-performance optical devices. In this talk, we will give an overview on our research in the field of silicon photonic hybrid (SOH) electro-optic modulators. The SOH concept combines advanced silicon photonic circuitry with highly efficient organic electro-optic cladding materials, obtained through theory-guided molecular design. This approach opens new perspectives for advanced photonic integrated circuits in high-speed optical communications and paves the path towards highly efficient THz signal processing.
Thx Yoghi!
Ciao Bella!
"The Italian factory would be an “advanced packaging” plant that uses new technologies to weave together full chips out of tiles produced by Intel and other chipmakers, the sources said.
Intel is using the technology to draw in new customers such as Amazon’s cloud computing unit, but its only sites are in the United States."
https://www.cnbc.com/2021/10/23/italy-woos-intel-over-multibillion-euro-chip-plant-sources.html
GlobalFoundries said it has started the initial public offering of 55 million shares.
The semiconductor manufacturer Tuesday said the company is offering 33 million shares, and the rest are being offered by its existing shareholder, Mubadala Investment Company PJSC . The company said it expects the IPO price to be between $42 and $47 a share. It said Mubadala expects to grant underwriters a 30-day option to buy up to an additional 8.25 million shares at the public offering price, less underwriting discounts and commissions.
The company said it has applied to list its shares on the Nasdaq Global Select Market under the ticker GFS.
Write to Dave Sebastian at dave.sebastian@wsj.com
(END) Dow Jones Newswires
10-19-21 0707ET
Copyright (c) 2021 Dow Jones & Company, Inc
Excellent find spartex! We need to get this to ML's desk asap..."polymer solutions"...:) Great work!
Earnings announcement* for LWLG: Nov 08, 2021
Lightwave Logic, Inc. is estimated to report earnings on 11/08/2021. The upcoming earnings date is derived from an algorithm based on a company's historical reporting dates. Our vendor, Zacks Investment Research, might revise this date in the future, once the company announces the actual earnings date. The reported EPS for the same quarter last year was $-0.02.
https://www.nasdaq.com/market-activity/stocks/lwlg/earnings
Thx for posting Davisa...an enjoyable read... "Really, the goal here, is to make our technology ubiquitous into the optical network."... :)
A recent LWLG hire...Jungu Joseph Choi, Ph.D. Photonic Device Engineer
https://www.linkedin.com/in/jungu-joseph-choi-ph-d-2180b254?trk=public_post_share-update_social-details_comment_actor-name
Rockley Photonics
@RockleyPhotonic 15h
Rockley Photonics is hiring!
We’re on the hunt for a Capital Equipment Buyer. If you’ve got experience in procurement, fab manufacturing and supply chains, then this could be the position for you.
https://bit.ly/3Az1ozL
"Pharmasset, before it got acquired, had only 80 employees with no commercial products yet available. At first, Gilead offered $100 per share. However, Pharmasset considered it inadequate, and Pharmasset's CEO revealed to Gilead that it would deliver important information about its positive development at the American Association for the Study of Liver Diseases. If the positive product development information would be released to the market, Pharmasset's share price would surge higher, making the acquisition more expensive for Gilead. At last, the final price tag was as high as $137 per share, making the total acquisition price of $11 billion. Fast-forward four years later, this acquisition seems to be quite successful. Pharmasset's acquisition has brought Gilead the foundation for Sovaldi and Harvoni. Both Sovaldi and Harvoni have significantly increased the business performance of Gilead. In 2014 alone, Sovaldi generated nearly $10.3 billion in revenue, accounting for nearly 45.9% of Gilead's total revenue. For the full year 2015, Gilead expected to generate $32.1 billion in sales, a 31.4% year-over-year growth.
Substitute Lightwave Logic and a company Like Amazon/Facebook/Apple/Netfix or Google taking them over. "
What a great analogy Xster!
INTEGRATED PHOTONICS FOR AUTOMOTIVE
29 SEPT. 2021 at 15:00 - 16:30 (CEST)
The automotive industry is going through a rapid transformation, driven by electrification, autonomous vehicles, driver support systems, as well as changes in mobility patterns and city infrastructure. These trends will significantly influence the physical design and capability of vehicles as well as the broader social and economic impacts of changes to car/fleet use.
The increased need for sensors in vehicles, in the electric/hybrid drivetrains and advanced driver-assistance systems (ADAS) up to autonomous driving systems, creates new significant opportunities for the integrated photonics industry.
After the great success of our previous virtual roadmap launch event, PhotonDelta is excited to announce our upcoming launch event for the automotive roadmap.
https://www.photondelta.com/events/integrated-photonics-for-automotive/
Bingo!
Ironically, I started buying AMAT at the exact same time I started buying LWLG....2004 or so...LOVE both companies! I remember the catalyst for AMAT was their announcement that they were getting into the big flat panel TV display business, which was really just getting rolling back then. My goodness, how time flies!
I get a chill when I see the word "Polymer" in an AMAT illustration (Figure 2....) The amount of brain power working at Applied Materials is just scary...
"The next revolution in advanced packaging is hybrid bonding whereby chips and wafers can be directly connected in copper with no need for an interposer. Compared to TSVs, hybrid bonding will enable another 10X increase in I/O density and another 2X improvement in energy per bit."
https://blog.appliedmaterials.com/heterogeneous-design-and-advanced-packaging-enable-advances-ppact-even-classic-moores-law-scaling
Sept. 15, 2021 11:00-15:30 EDT
The GF Technology Summit offers an opportunity to discuss the challenges and opportunities in semiconductor design and manufacturing, learn about new technologies and solutions, and discover new ways to collaborate, partner and invest so that together we can deliver more innovation, more capabilities, more intuitive interaction, more intelligence, and more feature-rich solutions.
https://gf.swoogo.com/GFTechSummit2021-NorthAmerica#Top
Intel To Provide Foundry Services in First Phase Of U.S. Defense Dept. Program
Intel Corp. said it will provide commercial foundry services in the first phase of a U.S. Department of Defense program that aims to make circuits and commercial products required for the department's systems.
The chipmaker on Monday said its foundry services unit will partner with companies like International Business Machines Corp., Synopsys Inc., Cadence and others as part of the program, which is called Rapid Assured Microelectronics Prototypes - Commercial.
Chip-industry officials expect the shortage that has led to cuts in car production and driven up prices of some consumer electronics to ease in the coming months, with some effects likely to be felt for a long time.
Write to Dave Sebastian at dave.sebastian@wsj.com
(END) Dow Jones Newswires
08-23-21 0628ET
Copyright (c) 2021 Dow Jones & Company, Inc.
Interesting Steve...@ 8:15 CEO states "LiDAR will be in everything"
Intel and Airbus are involved with AEye...
https://optics.org/news/8/6/16
8/19/21
Global Foundries Reportedly Files For IPO, Suggesting Intel Acquisition Isn't In The Cards
Chip manufacturer that spun off from AMD years ago had reportedly been talking to Intel, but new report says it plans to go public instead Semiconductor manufacturer GlobalFoundries Inc. has reportedly filed confidentially for an initial public offering, which would suggest that talks about a merger with Intel Corp. could be done.
Reuters reported Wednesday afternoon (https://www.reuters.com/technology/exclusive-chipmaker-globalfoundries-files- confidentially-us-ipo-sources-2021-08-18/) that GlobalFoundries sent IPO paperwork to the Securities and Exchange Commission , with plans to seek a valuation of about $25 billion, according to unnamed sources. The company is expected to publicly reveal the filing in October, Reuters reported, but market conditions could change the timing.
The Wall Street Journal reported last month (https://www.wsj.com/articles/intel-is-in-talks-to-buy-globalfoundries- for-about-30-billion-11626387704) that GlobalFoundries and Intel (INTC) were discussing a potential merger as Intel looks to ramp up its direct manufacturing amid a semiconductor shortage. Sources told Reuters that GlobalFoundries was concerned that a tie-up with Intel would harm relations with other customers, and that Intel had not made a formal offer.
Well stated DS, I agree with your assessment.
"Ultra-High Speed Polymers"
""Preliminary results suggest that Lightwave Logic's recently developed electro-optic polymer material, designed based on customer input, displays unrivaled thermal performance tolerance as compared to any commercial solution in use today.
Two thumbs up!
Amazon agreement
"The company also announced advances in some of the fundamentals of chip manufacturing that it said will help vault its offerings forward. That includes a new design for transistors, a different way of connecting and powering them, and chip-packaging innovations that will make products smaller."
https://www.theedgemarkets.com/article/intel-pledges-retake-innovation-crown-changes-yardstick