Lightwave Logic Inc (LWLG)

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A great read...

The Fourth Era of Computing Needs More than Advanced Logic and Memory Chips
by Sundar Ramamurthy, Ph.D.
Sep 08, 2021

Applied Materials today held its third Master Class of the year, focusing on two important and fast-growing areas of the semiconductor industry: ICAPS and advanced packaging. ICAPS stands for IoT, Communications, Automotive, Power and Sensors. ICAPS encompasses all but the three most advanced nodes in foundry-logic. Advanced packaging is about heterogeneous design, which is increasingly being adopted by semiconductor and systems companies to drive their power, performance, area/cost and time-to-market (PPACt™) roadmaps as classic Moore’s Law 2D scaling slows.

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Into The Fourth Era Of Computing

In 2018, machines generated more data than humans for the first time. We believe this milestone marks the beginning of the fourth era of computing whereby the Internet of Things (IoT), Big Data and AI are creating a new wave of growth for the semiconductor industry, complementing the markets for PCs and smartphones which defined the second and third computing eras (see Figure 1). By 2025, we expect machines to generate 99 percent of the data created each year.[/I]

https://blog.appliedmaterials.com/fourth-era-computing-needs-more-advanced-logic-and-memory-chips
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Foundries need to work hand and glove with (AMAT) years before their products come to market, their magical machines make our world possible!