Lightwave Logic Inc (LWLG)

[tkg]

I get a chill when I see the word "Polymer" in an AMAT illustration (Figure 2....) The amount of brain power working at Applied Materials is just scary...

"The next revolution in advanced packaging is hybrid bonding whereby chips and wafers can be directly connected in copper with no need for an interposer. Compared to TSVs, hybrid bonding will enable another 10X increase in I/O density and another 2X improvement in energy per bit."


https://blog.appliedmaterials.com/heterogeneous-design-and-advanced-packaging-enable-advances-ppact-even-classic-moores-law-scaling