Lightwave Logic Inc (LWLG)

[tkg]

my final AMAT related post today, I promise...:)

Heterogeneous Design and Advanced Packaging Enable Advances in PPACt™ Even as Classic Moore’s Law Scaling Slows
by Nirmalya Maity, Ph.D.
Sep 02, 2021


Advanced Packaging Proving Ground

We bring these technologies together at our Advanced Packaging Development Center in Singapore—a state-of-the-art cleanroom that is among the most advanced wafer-level packaging labs in the world. It’s where we enable the foundational building blocks of heterogeneous integration, including advanced bump and micro-bump, fine-line redistribution layer (RDL), TSV and hybrid bonding (see Figure 2). The Center gives us a unique ability to co-optimize process technologies and fully validate their robustness with test vehicles.


Figure 2:

Polymer RDL/Si Interposer...??

https://blog.appliedmaterials.com/heterogeneous-design-and-advanced-packaging-enable-advances-ppact-even-classic-moores-law-scaling