Replies to post #129521 on Intel Corp (INTC)

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Bay Trail has a bloated BoM, so I don't think that product will ever end up in ultra cheap devices profitably...even with their BoM reduction program that's currently ongoing (which Intel claims will cut the BoM deficiency in Bay Trail by about 50% by year's end).

The 22nm generation has just been a disaster for Intel's mobile designs and I think low wafer costs won't offset the fundamental problems with those designs.

[Dmcq]

You do realize the advantage that Intel has here with their own manufacturing process, don't you?

There's some advantages with earlier access and a more advanced technology but we're not talking about anything like that here. As far as making things is concerned one has the same costs whether the manufacture is in house or not and the overall question is whether outside manufacture is more efficient and dependable or not.

[Andy Grave]

CT+ is winning share in devices from Rockchip, Allwinner, and Mediatek - all of whom need to pay the pricing for wafers on TSMC's leading-edge 28nm process, while Intel's "bloated" die size likely leads to a lower cost structure on Intel's ultra-low and fully depreciated 32nm wafer costs.

.....how large do you believe the 28nm Allwinner, Rockchip and MediaTek chips are?......the ones that have higher cost structure than 32nm CT+.