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Theo

07/15/24 9:19 AM

#409 RE: SSP #408

Now there are multiple ways that MST can be deposited on wafers for customers going to production. MST-enhanced thin RF-SOI wafers could be supplied by a wafer manufacturer, deposited by the foundry making the devices, or implemented directly by an IDM

Imo, this is a huge advantage for Atomera and a significant advancement on their part. For the past 2-3 years, it was TCAD that was Atomera's selling point- something (software program) a prospective customer could use to "try out" and experiment MST with. Now, you can get an actual chip (built to your specs) and try it out.

I am referring to RFSOI exclusively at this point- but I don't see why this won't or couldn't apply to POWER, DRAM, and others in the future as well.
Bullish
Bullish