Advanced Micro Devices Inc (AMD)

[oc detective]

Again this new variation on your original argument is somewhat flawed. Why would a system developer need to know the power dissipation relative to temperature as recommended thermal solutions designed around the maximum TDP thus highest TCase max are given in the "Builders Guide".
The table no more helps them than what is contained within the aforementioned Builders Guide. They are not likely to test every cpu to find the Tcase max value so that they could gamble upon using an inferior cooling solution. Which based on your theory as to what this table is, would be the only reason system builders would refer to it.
Besides dont you think that the table would be in that document if it was for their benefit?
As to system builders using an appropriate thermal profile when designing their systems - each thermal profile is specific to an different family of cpus i.e Dual core is Profile "I" they are not interchangeable, with the thermal profile presumably (guessing here) based on the characteristics of the cpu and the recommended heat sink/fan solutions.